Table of Contents GEM80-400
Page xvi
ALSPA
GEM80-400 SERIES CONTROLLERS TECHNICAL MANUAL Issue 3 04/99
7.4.3. Examples of Cubicle Layout................................................................................7-4
7.4.4. Position of GEM80 Controller...............................................................................7-6
7.4.5. Access Requirements ..........................................................................................7-6
7.4.6. Heat Dissipation of I/O Modules..........................................................................7-7
7.4.7. Minimum Panel Spacings ....................................................................................7-7
7.4.8. Cable Routing and Segregation ........................................................................7-8
7.4.9. Pre-cut Ribbon Cable Lengths............................................................................7-8
7.5. Cabling GEM80.............................................................................................................7-9
7.5.1. Tools for Cabling...................................................................................................7-9
7.5.1.1. Ribbon Cables .............................................................................................7-9
7.5.2. Safety Earth Wiring...............................................................................................7-9
7.5.3. Signal Ground Wiring ...........................................................................................7-9
7.5.3.1. Signal Ground Bar........................................................................................7-9
7.5.3.2. GEM 80 0V..................................................................................................7-10
7.5.3.3. Screen Signal Grounds..............................................................................7-11
7.5.4. Wiring Segregation Within GEM 80 Cubicles....................................................7-11
7.5.5. Interconnecting GEM 80 ...................................................................................7-11
7.6. Plant Cabling External to GEM 80 Cubicles..............................................................7-11
7.6.1. General...............................................................................................................7-11
7.6.2. Segregation........................................................................................................7-12
7.6.2.1. General ......................................................................................................7-12
7.6.2.2. Basic and Verification I/O Ribbons ..........................................................7-12
7.6.2.3. Signal Ground............................................................................................7-12
7.6.2.4. Further Information on Plant Cabling.......................................................7-12
7.7. I/O Plant-Side Power Supply Connection.................................................................7-13
7.8. Installation of Modules................................................................................................7-13
7.8.1. Module Retention ..............................................................................................7-13
7.9. Address Decoder Switches and Address Marking...................................................7-14
7.9.1. Address Decoder Switches...............................................................................7-14
7.9.2. Address and Module Label Marking................................................................7-14
7.10. Ribbon Cable Connectors.......................................................................................7-15
8. Commissioning ......................................................................................................................8-1
8.1. Introduction...................................................................................................................8-1
8.2. Preparation....................................................................................................................8-1
8.3. Documents Required ...................................................................................................8-1
8.4. Overview of Commissioning Procedure .....................................................................8-2
8.5. Safety Circuits Checks..................................................................................................8-2
8.6. Power Module Checks.................................................................................................8-3
8.7. Processor Module Checks............................................................................................8-4
8.8. Central Highway Modules............................................................................................8-6
8.9. Loading an Initial User Program...................................................................................8-6
8.10. Basic and Verification I/O Logic Input Checks.........................................................8-6
8.11. Other Basic and Verification I/O Input Checks........................................................8-8
8.12. Fast I/O Input Checks .................................................................................................8-8
8.13. Basic, Verification and Fast I/O Output Checks.......................................................8-9
8.14. Connecting Output Equipment...............................................................................8-10
8.15. Loading the User Program .......................................................................................8-10
8.16. Serial Links..................................................................................................................8-10
8.16.1. Printer Ports .......................................................................................................8-11
8.16.2. Processor Serial Links Connecting Controllers................................................8-11
8.16.3. GEMSTART CCU Ports.......................................................................................8-12
8.16.4. Further Details...................................................................................................8-12
8.17. Fitting a Memory Expansion Board to the Processor Module ............................... 8-12
8.18. Processor Modules fitted with FIP Interface Facility ...............................................8-12
8.19. A Few Final Comments.............................................................................................8-13
To Next Page
Loading...