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Anritsu 680 B Series User Manual

Anritsu 680 B Series
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SERIES
680XXB/681XXB
SYNTHESIZED CW/SWEEP GENERATORS
MAINTENANCE MANUAL
P/N: 10370-10262
REVISION: F
PRINTED: AUGUST 2003
COPYRIGHT 2003 ANRITSU CO.
490 JARVIS DRIVE
MORGAN HILL, CA 95037-2809

Table of Contents

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Anritsu 680 B Series Specifications

General IconGeneral
BrandAnritsu
Model680 B Series
CategoryPortable Generator
LanguageEnglish

Summary

Chapter 1 General Information

1-1 SCOPE OF MANUAL

Defines the scope and content of the maintenance manual for 680XXB/681XXB generators.

1-2 INTRODUCTION

Provides an overview of the manual's content, including descriptions, manuals, options, and maintenance levels.

1-3 DESCRIPTION

Describes the Series 680XXB/681XXB generators as microprocessor-based, synthesized signal sources.

1-4 IDENTIFICATION NUMBER

Explains the unique six-digit ID number assignment and its importance for ordering parts and correspondence.

1-5 ELECTRONIC MANUAL

Details the availability and features of the electronic manual on CD ROM, including Acrobat Reader.

1-6 RELATED MANUALS

Lists the four-manual set: Operation, GPIB Programming, SCPI Programming, and Maintenance Manuals.

1-7 OPTIONS

Lists available instrument options such as Rack Mounting, Step Attenuators, and High Power Output.

1-8 LEVEL OF MAINTENANCE

Outlines the maintenance procedures including troubleshooting, repair, calibration, and preventive maintenance.

1-9 PREVENTIVE MAINTENANCE

Describes the procedure for cleaning the fan honeycomb filter to ensure adequate ventilation and prevent overheating.

1-10 STATIC-SENSITIVE COMPONENT HANDLING PRECAUTIONS

Details precautions for handling static-sensitive components to prevent damage.

1-11 STARTUP CONFIGURATIONS

Explains how to change the instrument's startup configuration from operate to standby mode.

1-12 RECOMMENDED TEST EQUIPMENT

Lists recommended test equipment for performance verification, calibration, and troubleshooting procedures.

1-13 EXCHANGE ASSEMBLY PROGRAM

Describes ANRITSU's exchange assembly program for defective subassemblies and RF components.

1-14 REPLACEABLE SUBASSEMBLIES AND PARTS

Lists replaceable subassemblies and RF components covered by the exchange program and common parts.

Chapter 2 Functional Description

2-1 INTRODUCTION

Provides brief functional descriptions of major subsystems, operation of frequency synthesis, ALC, and RF deck.

2-2 680XXB/681XXB MAJOR SUBSYSTEMS

Identifies and describes the distinct subsystems that make up the instrument.

Digital Control

Describes the CPU and interface PCBs that control instrument functions, memory, and communication.

Front Panel

Details the front panel subsystems including PCB, control PCB, and LCD display, interfacing with the CPU.

Frequency Synthesis

Explains the subsystem for phase-lock control of output frequency using four phase-lock loops.

Analog Instruction

Describes the PCB providing frequency tuning voltages and band select signals for YIG driver and SDM/SQM.

YIG Driver

Details the PCB supplying tuning current and bias voltages for the YIG-tuned oscillator and down converter.

ALC/Modulation

Covers the subsystem for automatic level control, AM, and square wave modulation of RF output signals.

RF Deck

Describes elements related to RF signal generation, modulation, and control, including oscillator and converters.

Power Supply

Explains the subsystem that supplies regulated DC voltages to the instrument circuits.

Inputs/Outputs

Describes interface circuits for rear panel connectors, including BNC, AUX I/O, GPIB, and SERIAL I/O.

2-3 FREQUENCY SYNTHESIS

Details the frequency synthesis subsystem's phase-lock control and operation of four phase-lock loops.

Phase Lock Loops

Explains the purpose and operation of phase-lock loops for controlling oscillator frequency accuracy and stability.

Overall Operation

Describes the overall operation of the frequency synthesis subsystem, including YIG-tuned oscillator control.

RF Outputs 0.01 to 65 GHz

Details how RF output frequencies are generated from the YIG-tuned oscillator across various ranges.

Frequency Modulation (681XXB only)

Explains how frequency modulation of the RF output is performed using external signals.

Analog Sweep Mode (681XXB only)

Describes broad-band and narrow-band analog frequency sweeps and their phase-lock correction.

Step Sweep Mode

Explains digital frequency sweeps consisting of discrete, synthesized steps between frequencies.

2-4 ALC AND MODULATION

Details the subsystem for automatic level control (ALC) and modulation (AM, Square Wave) of RF output.

ALC Loop Operation

Describes how the ALC loop detects RF output level and uses feedback for level control.

Amplitude Modulation (681XXB only)

Explains how amplitude modulation is accomplished by summing external modulating signals into the ALC loop.

Power Sweep

Describes the mode where the CPU steps the RF output through a range of levels for identical frequency sweeps.

Square Wave Modulation (681XXB only)

Explains square wave modulation by turning RF output on/off using internally generated or external inputs.

2-5 RF DECK ASSEMBLIES

Describes the purpose and configurations of the RF deck assembly for generating CW and swept RF signals.

RF Deck Configurations

Details the variations in RF deck assemblies based on instrument model and frequency range.

YIG-tuned Oscillator

Describes the oscillator containing two oscillators covering 2-8.4 GHz and 8.4-20 GHz, driven by FM and main tuning currents.

Power Level Control and Modulation

Explains how the modulator provides power level control and AM/square wave modulation for RF output.

RF Signal Filtering

Details routing of RF signals via PIN switches to low-pass filters and signal coupling for down conversion.

0.01 to 2 GHz Down Converter

Describes the assembly containing a 6.5 GHz VCO for generating 0.01 to 2 GHz RF output frequencies.

0.5 to 2.2 GHz Digital Down Converter

Details the assembly providing improved phase noise across 0.5 to 2.2 GHz frequency range.

Switched Doubler Module

Explains the module used to double fundamental frequencies for outputting 20 to 40 GHz RF signals.

Source Quadrupler Module

Describes the module used to quadruple fundamental frequencies for producing 40 to 65 GHz RF output.

Power Level Detection/ALC Loop

Explains how RF output signal is detected and fed back to ALC circuitry for level control.

Step Attenuator

Details the optional step attenuator providing up to 110 dB attenuation in 10 dB steps.

Chapter 3 Performance Verification

3-1 INTRODUCTION

Contains tests to verify generator performance against specifications, supporting all models and options.

3-2 RECOMMENDED TEST EQUIPMENT

Provides a list of recommended test equipment for performance verification procedures.

3-3 TEST RECORDS

Offers sample test records for documenting instrument performance and initial test results.

3-4 CONNECTOR AND KEY LABEL NOTATION

Explains references to specific labels for controls, connectors, and test equipment used in procedures.

3-5 680XXB/681XXB POWER LEVELS

Lists models and their maximum leveled output power levels for test procedure reference.

3-6 INTERNAL TIME BASE AGING RATE TEST

Verifies the 10 MHz time base aging specification using an internal crystal oscillator.

3-7 FREQUENCY SYNTHESIS TESTS

Tests the frequency synthesis circuits, divided into coarse/YIG loop and fine loop tests.

3-8 SPURIOUS SIGNALS TEST: RF OUTPUT SIGNALS ≤2 GHz

Verifies spurious signal specifications for RF output signals from 0.01 to 2 GHz.

3-9 HARMONIC TEST: RF OUTPUT SIGNALS FROM 2 TO 20 GHz

Verifies harmonic specifications for RF output signals from 2 to 20 GHz.

3-10 SINGLE SIDEBAND PHASE NOISE TEST

Verifies single sideband phase noise specifications by mixing DUT output with a LO.

3-11 POWER LEVEL ACCURACY AND FLATNESS TESTS

Verifies generator's power level specifications through accuracy and flatness tests.

Chapter 4 Calibration

4-1 INTRODUCTION

Provides procedures for calibrating generators due to out-of-tolerance conditions or component replacement.

4-2 RECOMMENDED TEST EQUIPMENT

Lists recommended test equipment for calibration procedures, including front panel control settings.

4-3 TEST RECORDS

Offers sample calibration test records for documenting instrument calibration results.

4-4 CALIBRATION FOLLOWING SUBASSEMBLY REPLACEMENT

Lists calibrations required after replacing specific subassemblies or RF components.

4-5 CONNECTOR AND KEY LABEL NOTATION

Explains labels for equipment interconnections and control settings used in calibration procedures.

4-6 INITIAL SETUP

Details the initial setup for calibration, including PC interfacing and Windows 3.1/95 configuration.

4-7 PRELIMINARY CALIBRATION

Provides steps for initial calibration of coarse loop, fine loop, frequency instruction, and DVM circuitry.

4-8 SWITCHED FILTER SHAPER CALIBRATION

Details procedures to adjust Switched Filter Shaper Amplifier gain for consistent level gain.

4-9 RF LEVEL CALIBRATION

Describes automated test system calibration for power output accuracy and storage of correction factors.

4-10 ALC SLOPE CALIBRATION

Explains ALC Slope DAC calibration to adjust for increasing/decreasing output power-vs-frequency.

4-11 ALC BANDWIDTH CALIBRATION

Details procedure for ALC Bandwidth calibration to compensate for modulator gain variations.

4-12 AM CALIBRATION

Provides steps to calibrate AM Calibration DAC and AM Meter circuit for input sensitivities.

4-13 FM CALIBRATION

Details procedures for FM calibration, adjusting FM Calibration DAC for input sensitivities in various modes.

Chapter 5 Troubleshooting

5-1 INTRODUCTION

Provides information for troubleshooting malfunctions and fault isolation to replaceable subassemblies.

5-2 RECOMMENDED TEST EQUIPMENT

Lists recommended test equipment for troubleshooting procedures, referencing Chapter 1.

5-3 ERROR AND WARNING/STATUS MESSAGES

Summarizes error, warning, and status messages indicating malfunctions or operating conditions.

Self-Test Error Messages

Details internal diagnostics that perform brief go/no-go tests on instrument PCBs and assemblies.

Normal Operation Error/Warning Messages

Lists and describes error, warning, and status messages displayed during normal instrument operation.

5-4 MALFUNCTIONS NOT DISPLAYING AN ERROR MESSAGE

Provides troubleshooting procedures for malfunctions that cause non-operational states or RF output issues.

5-5 TROUBLESHOOTING TABLES

Offers procedures for isolating malfunctions to replaceable subassemblies or RF components.

Connector and Test Point Locations

Illustrates the location of connectors and test points on the instrument for troubleshooting.

Chapter 6 Removal and Replacement Procedures

6-1 INTRODUCTION

Provides procedures for gaining access to major assemblies, subassemblies, and components for troubleshooting.

6-2 REMOVING AND REPLACING THE CHASSIS COVERS

Details the step-by-step process for removing and replacing the instrument's chassis covers.

6-3 REMOVING AND REPLACING THE FRONT PANEL ASSEMBLY

Provides instructions for removing and replacing the front panel assembly, including PCBs and rotary knob.

6-4 REMOVING AND REPLACING THE A3, A4, A5, OR A6 PCB

Describes removal and replacement of specific PCBs located in the RF housing.

6-5 REMOVING AND REPLACING THE A7 PCB

Details the procedure for removing and replacing the A7 YIG Loop PCB from the main card cage.

6-6 REMOVING AND REPLACING THE A9, A10, A11, OR A12 PCB

Provides instructions for removing and replacing the A9, A10, A11, or A12 PCBs in the main card cage.

6-7 REMOVING AND REPLACING THE A13, A14, OR A15 PCB

Describes removal and replacement of PCBs located in the main card cage, including heat sink subassemblies.

6-8 REMOVING AND REPLACING THE A16 OR A17 PCB

Details the procedure for removing and replacing the A16 or A17 CPU PCBs in the CPU housing assembly.

6-9 REMOVING AND REPLACING THE A18 OR A19 PCB

Provides instructions for removing and replacing PCBs in the power supply housing assembly.

6-10 REMOVING AND REPLACING THE REAR PANEL ASSEMBLY

Details the process for removing and replacing the rear panel assembly, including PCBs and fan assembly.

6-11 REMOVING AND REPLACING THE A21 PCB

Provides instructions for removing and replacing the A21 Line Filter/Rectifier PCB on the rear panel assembly.

6-12 REMOVING AND REPLACING THE A21-1/A21-2 PCB

Details the procedure for removing and replacing the BNC/AUX I/O Connector PCB on the rear panel assembly.

6-13 REMOVING AND REPLACING THE FAN ASSEMBLY

Explains the process for removing and replacing the fan assembly located on the rear panel assembly.

Appendix A Test Records

A-1 INTRODUCTION

Introduces test records for Performance Verification and Calibration, providing a history of instrument performance.

3-6 Internal Time Base Aging Rate Test Records

Test record for verifying the 68037B/68137B time base aging specification.

3-7 Frequency Synthesis Tests Records

Test records for measuring coarse loop/YIG loop and fine loop frequencies for synthesis tests.

3-8 Spurious Signals Test Records

Test records for measuring spurious signals for RF output signals <2 GHz.

3-10 Single Sideband Phase Noise Test Records

Test records for measuring phase noise levels at specified offsets for various frequencies.

3-11 Power Level Accuracy and Flatness Tests Records

Test records for measuring power level accuracy and flatness across frequency ranges.

4-7 Preliminary Calibration Records

Records for preliminary calibration steps including DVM, loops, and DAC calibrations.

4-8 Switched Filter Shaper Calibration Records

Records for Log Amplifier Zero, Limiter DAC, and Shaper DAC adjustments.

4-10 ALC Slope Calibration Records

Records for ALC Slope DAC adjustment for frequencies <2 GHz and >2 GHz.

4-11 ALC Bandwidth Calibration Records

Records for ALC Bandwidth calibration and storing DAC setting values.

4-13 FM Calibration Records

Records for FM Meter, Wide/Narrow Sensitivity, and Rear Panel Input Gain calibrations.

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