ASROCK B365M-HDV User Manual

Version 1.0
Published February 2018
Copyright©2018 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com

ASROCK B365M-HDV Specifications

General

Audio chip	Realtek ALC887
Certification	FCC, CE, ErP/EuP
Component for	PC
Motherboard chipset	Intel B365
PC health monitoring	FAN, Temperature, Voltage
Audio output channels	7.1 channels
Motherboard form factor	micro ATX
Motherboard chipset family	Intel
Windows operating systems supported	Windows 10 Education x64, Windows 10 Enterprise x64, Windows 10 Home x64, Windows 10 Pro x64, Windows 10 x64
Intel® Optane™ Memory Ready	Yes
Processor socket	LGA 1151 (Socket H4)
Compatible processor series	Intel Celeron, Intel Core i3, Intel Core i5, Intel Core i7, Intel Core i9, Intel Pentium
Maximum number of SMP processors	1
Memory channels	Dual-channel
Memory slots type	DIMM
Number of memory slots	2
Supported memory types	DDR4-SDRAM
Maximum internal memory	32 GB
Supported memory clock speeds	2133, 2400, 2666 MHz
BIOS type	UEFI AMI
ACPI version	6.0
BIOS memory size	128 Mbit
System Management BIOS (SMBIOS) version	2.7
DirectX version	12.0
Maximum resolution	4096 x 2160 pixels
Parallel processing technology support	-
HDMI version	1.4
eSATA ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	4
Wi-Fi	No
LAN controller	Intel® I219-V
Ethernet interface type	Gigabit Ethernet
Number of SATA III connectors	6
RAID levels	0, 1, 5, 10
Supported storage drive interfaces	SATA III
Cables included	SATA
Bundled software	ASRock A-Tuning ASRock XFast LAN
Harmonized System (HS) code	84733020

Weight and Dimensions

Depth	188 mm
Width	226 mm

Summary

Chapter 1 Introduction

1.1 Package Contents

Lists the items included in the motherboard package.

1.2 Specifications

Platform

Specifies the motherboard form factor and design features.

CPU

Details CPU compatibility and technologies supported.

Chipset

Identifies the motherboard chipset.

Memory

Describes memory technology, slots, and capacity.

Expansion Slot

Lists PCI Express slot types and configurations.

Graphics

Details integrated graphics capabilities and supported features.

Audio

Details audio features, codec, and protection.

LAN

Describes LAN controller and features.

Rear Panel I/O

Lists the connectors available on the rear I/O panel.

Storage

Details SATA and M.2 storage connectors and capabilities.

Connector

Lists various onboard headers and connectors.

BIOS Feature

Outlines BIOS functionalities and support.

Hardware Monitor

Describes hardware monitoring features like temperature and fan speed.

OS

Specifies the supported operating system.

Certifications

Lists regulatory and safety certifications.

Chapter 2 Installation

Pre-installation Precautions

Lists essential precautions before installing motherboard components.

2.1 Installing the CPU

Provides step-by-step instructions for CPU installation.

2.2 Installing the CPU Fan and Heatsink

Guides on how to install the CPU fan and heatsink assembly.

2.3 Installing Memory Modules (DIMM)

Details the procedure for installing DDR4 memory modules.

2.4 Expansion Slots (PCI Express Slots)

Explains the types and usage of PCI Express slots.

2.5 Jumpers Setup

Explains jumper configurations and their functions.

Clear CMOS Jumper

Explains how to clear CMOS settings using a jumper.

2.6 Onboard Headers and Connectors

Details various onboard headers and their connection points.

System Panel Header

Details the system panel header for power/reset buttons and LEDs.

Chassis Intrusion and Speaker Header

Explains the header for chassis intrusion detection and speaker.

Serial ATA3 Connectors

Lists and describes the six SATA3 connectors.

USB 2.0 Headers

Details the two USB 2.0 headers and their port capacity.

USB 3.1 Gen1 Header

Explains the USB 3.1 Gen1 header and its port capacity.

Front Panel Audio Header

Details the front panel audio header and connection instructions.

Chassis/Water Pump Fan Connectors

Explains the chassis and water pump fan connectors.

CPU Fan Connector

Details the 4-pin CPU fan connector and its compatibility.

ATX Power Connector

Explains the 24-pin ATX power connector and usage with 20-pin supplies.

ATX 12V Power Connector

Details the 8-pin ATX 12V power connector and usage with 4-pin supplies.

Serial Port Header

Explains the COM1 header for serial port modules.

TPM Header

Details the TPM header for secure key storage and platform integrity.

Print Port Header

Explains the LPT1 header for printer connections.

2.7 M.2_SSD (NGFF) Module Installation Guide

Guides through the process of installing an M.2 SSD.

Installing the M.2_SSD (NGFF) Module

Provides steps for mounting and securing the M.2 SSD.

Contact Information

DECLARATION OF CONFORMITY

EU Declaration of Conformity