ASROCK H570M Pro4 - Platform and CPU Specifications; Chipset and Memory Specifications; Expansion Slot Specifications

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H570M Pro4
1.2 Specications
Platform
•
Micro ATX Form Factor
•
Solid Capacitor design
CPU
•
Supports 10
th
Gen Intel® Core
TM
Processors and 11
th
Gen
Intel® Core
TM
Processors (LGA1200)
•
Digi Power design
•
8 Power Phase design
•
Supports Intel® Turbo Boost Max 3.0 Technology
Chipset
•
Intel® H570
Memory
•
Dual Channel DDR4 Memory Technology
•
4 x DDR4 DIMM Slots
•
11
th
Gen Intel® Core
TM
Processors support DDR4 non-ECC,
un-buered memory up to 4800+(OC)*
•
10
th
Gen Intel® Core
TM
Processors support DDR4 non-ECC,
un-buered memory up to 4600+(OC)*
* 11
th
Gen Intel® Core
TM
(i9/i7/i5) support DDR4 up to 2933;
Core
TM
(i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10
th
Gen Intel® Core
TM
(i9/i7) support DDR4 up to 2933; Core
TM
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
•
Max. capacity of system memory: 128GB
•
Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
11
th
Gen Intel® Core
TM
Processors
•
1 x PCI Express 4.0 x16 Slot (PCIE1)
10
th
Gen Intel® Core
TM
Processors
•
1 x PCI Express 3.0 x16 Slot (PCIE1)
* Supports NVMe SSD as boot disks
•
1 x PCI Express 3.0 x4 Slot
•
1 x PCI Express 3.0 x1 Slot
•
Supports AMD Quad CrossFireX
TM
and CrossFireX
TM
•
1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module
and Intel® CNVi (Integrated WiFi/BT)