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ASROCK H670M PRO RS - Detailed Motherboard Specifications

ASROCK H670M PRO RS
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English
5
H670M Pro RS
1.2 Specications
Platform
•
Micro ATX Form Factor
•
Solid Capacitor design
CPU
•
Supports 12
th
Gen Intel® Core
TM
Processors (LGA1700)
•
Digi Power design
•
7 Power Phase design
•
Supports Intel® Hybrid Technology
•
Supports Intel® Turbo Boost Max 3.0 Technology
Chipset
•
Intel® H670
Memory
•
Dual Channel DDR4 Memory Technology
•
4 x DDR4 DIMM Slots
•
Supports DDR4 non-ECC, un-buered memory up to
4800+(OC)*
* Supports DDR4 3200 natively.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
•
Max. capacity of system memory: 128GB
•
Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
•
2 x PCIe x16 Slots (PCIE1/PCIE3: single at Gen4x16 (PCIE1);
dual at Gen4x16 (PCIE1) / Gen3x4 (PCIE3))*
* Supports NVMe SSD as boot disks
•
1 x PCIe Gen3x1 Slot
•
Supports AMD Quad CrossFireX
TM
and CrossFireX
TM
•
1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe
WiFi module
Graphics
•
Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
•
Intel® X
e
Graphics Architecture (Gen 12)
•
Dual graphics output: support HDMI and DisplayPort 1.4
ports by independent display controllers

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