Danfoss VLT AutomationDrive FC 302 - Back-Channel Cooling Overview

5.7 Back-channel Cooling Overview
A unique back-channel duct passes cooling air over the heat sinks with minimal air passing through the electronics area.
There is an IP54/Type 12 seal between the back-channel cooling duct and the electronics area of the VLT
®
drive. This back-
channel cooling allows 90% of the heat losses to be exhausted directly outside the enclosure. This design improves
reliability and prolongs component life by dramatically reducing interior temperatures and contamination of the electronic
components. Dierent back-channel cooling kits are available to redirect the airow based on individual needs.
5.7.1 Airow for D1h–D8h Enclosures
130BG068.10
225 mm (8.9 in)
225 mm (8.9 in)
225 mm (8.9 in)
225 mm (8.9 in)
225 mm (8.9 in)
225 mm (8.9 in)
Illustration 5.10 Standard Airow Conguration for Enclosures D1h/D2h (Left), D3h/D4h (Center), and D5h–D8h (Right).
130BG069.10
225 mm (8.9 in)
225 mm (8.9 in)
225 mm (8.9 in)
Illustration 5.11 Optional Airow Conguration Using Back-channel Cooling Kits for Enclosures D1h–D8h.
(Left) In-bottom/out-back cooling kit for enclosures D1h/D2h.
(Center) In-bottom/out-top cooling kit for enclosures D3h/D4h.
(Right) In-back/out-back cooling kit for enclosures D5–D8h.
Product Features Design Guide
MG38C202 Danfoss A/S © 01/2018 All rights reserved. 29
5 5