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General| Technology | Screen Printing |
|---|---|
| Printing Speed | Up to 150 mm/sec |
| Screen Frame Size | 736 mm x 736 mm |
| Power Supply | 220-240 V, 50/60 Hz |
| Air Pressure Requirement | 6 bar |
| Registration Accuracy | ±12.5 microns at 6 Sigma |
Specifications for screen frame types and sizes including external and internal dimensions.
Details on board handling capabilities, including minimum/maximum size, thickness, warpage, and transport.
Key process parameters like print speed, print pressure, print gap, and stencil separation.
Details on available print modes such as ProFlow, Print Print, and Print Flood.
Information on paste knead settings: number, period, and on demand.
Specifications for the vision system, including system type and camera lighting.
Information on fiducial types, size, position, and error recovery for alignment.
Details on alignment repeatability, cycle time, product changeover, and setup time.
Description of hardware (touch screen) and software (Windows NT) for operation.
Details of the ProFlow optional print material transfer system.
Information on 2D inspection capabilities for quality monitoring.
Overview of available tooling options for board support, including magnetic pillars and pins.
Information on the paper under screen cleaner and its operation.
Details on the optional paste dispenser for precise solder paste application.
Specifications for temperature and humidity sensing within the printing area.
Information on environmental control units for managing temperature and humidity.
Details on Statistical Process Control (SPC) techniques for quality verification.
Information on alternative board clamping methods like edge clamps and foil-less clamps.
Desktop application for remote status monitoring and reliability analysis of printers.
Details on GEM for standard communications in factory automation.
Option to print or pass boards based on fiducial location.
Printing flexible boards that may not be flat when loaded.
Optional alternative to camera board stop for large or heavy boards.
Option to reduce machine cycle time from 12.5 to 10 seconds.
Software for controlling product changeover via barcode scanning.
Desktop application for creating and editing product files off-printer.
LAN package for transferring data within the factory network.
Details on CE and ETL certifications for compliance.
Information on power supply and air supply requirements.
Details on approximate weight and dimensions for shipping.
Description of the integrated camera assembly with telecentric lenses and flat lighting.
Explanation of telecentric lenses for accurate alignment despite board variations.
Details on flat lighting design for high-quality image processing and accurate alignment.
Overview of PatMax object location software for precise stencil-to-board alignment.
Alternative alignment method using video correlation when fiducials are unsuitable.
Details on the Windows NT operating system used for printer control and interface.
Description of the diagnostic module for calibration and fault diagnosis.
Calculates predicted paste volume based on inspection results.
Overview of available inspection licenses for board and stencil inspection.
Vision system inspections for stencil cleanliness, blockage, and smear.
Vision system inspections for board paste presence, alignment, and bridging.
Details on the Vortex under screen cleaner with foam cassette.
Traditional method of securing boards using foil and pneumatics.
Option for thin boards using vacuum to secure the board edge.
Secures boards at the edge using adjustable and fixed clamps.
System tailored for specific board support during printing.
Details on the 3-piece construction of the dedicated tooling plate.
Tooling plate with adjustable side plates and steel pins for board support.
Fully automatic tooling facility with programmable board support pins.
Automated tooling facility with pin modules for supporting boards.
Software option to print boards up to 620mm long.
Delivers conditioned air to maintain optimum paste operating conditions.
Manages temperature, humidity, and airflow for optimal paste conditions.
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