Table 31. Con
guration based ambient temperature restrictions
Storage con
guration Chassis or
hardware
conguration
CPU Thermal Design
Power (TDP)
CPU heat sink Fan type
Ambient
restriction
12 x 3.5 inch
Mid (SAS) and
rear drive
200 W/180 W 1U high performance High performance 30°C
12 x 3.5 inch
Mid (SAS) and
rear drive
120-170 W 1U standard High performance 35°C
24 x 2.5 inch
Mid (SAS) and
rear drive
All
1U high performance for
180/200W
1U standard for 120-170W
High performance 35°C
24 x 2.5 inch
All PCIe cards 200 W/180 W 2U Standard 35°C
12 x 3.5 inch
All PCIe cards 200 W/180 W 2U Standard 35°C
8 x 3.5 inch
All PCIe cards 200 W/180 W 2U Standard 35°C
24 NVMe
All PCIe cards 200 W/180 W 2U Standard 35°C
Particulate and gaseous contamination specica
tions
The following table denes the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If
the levels of particulate or gaseous pollution exceed the specied limitations and result in equipment damage or failure, you may need to
rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 32. Particulate contamination specications
Particulate contamination Specications
Air ltr
ation Data center air ltration as dened by ISO Class 8 per ISO 14644-1 with a
95% upper condence limit.
NOTE
: The ISO Class 8 condition applies to data center
environments only. This air ltration requirement does not apply to
IT equipment designed to be used outside a data center, in
environments such as an oce or factory oor.
NOTE
: Air entering the data center must have MERV11 or MERV13
ltration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive
particles
.
NOTE
: This condition applies to data center and non-data center
environments.
Corrosive dust
• Air must be free of corrosive dust.
• Residual dust present in the air must have a deliquescent point less than
60% r
elative humidity.
36 Technical specications
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