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Dell EMC PowerEdge R440 - Particulate and Gaseous Contamination Specifications

Dell EMC PowerEdge R440
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Table 24. Maximum shock specications
Maximum shock Specications
Operating Six consecutively executed shock pulses in the positive and negative x, y,
and z axes of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y,
and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Table 25. Maximum altitude specications
Maximum altitude Specications
Operating
3048 m (10,000 ft)
Storage 12,000 m (39,370 ft)
Table 26. Operating temperature derating specications
Operating temperature derating Specications
Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m
(3,117 ft).
35°C to 40°C (95°F to 104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m
(3,117 ft).
40°C to 45°C (104°F to 113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m
(3,117 ft).
Particulate and gaseous contamination specications
The following table denes the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If
the levels of particulates or gaseous pollution exceed the specied limitations and result in equipment damage or failure, you may need to
rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.
Table 27. Particulate contamination
specications
Particulate contamination Specications
Air ltration Data center air ltration as dened by ISO Class 8 per ISO 14644-1 with a
95% upper condence limit.
NOTE: This condition applies to data center environments only. Air
ltration requirements do not apply to IT equipment designed to be
used outside a data center, in environments such as an oce or
factory oor.
NOTE: Air entering the data center must have MERV11 or MERV13
ltration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive
particles.
NOTE: This condition applies to data center and non-data center
environments.
Technical specications 29

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