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Dell PowerEdge R310 Manual

Dell PowerEdge R310
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Dell™ Glossary
NOTE: For additional information on storage terminology, visit the Storage
Networking Industry Association's website at www.snia.org and click on the
dictionary.
A — Ampere(s).
AC — Alternating current.
ACPI — Advanced Configuration and Power Interface. A standard interface for
enabling the operating system to direct configuration and power management.
ambient temperature — The temperature of the area or room where the system is
located.
ANSI — American National Standards Institute. The primary organization for
developing technology standards in the U.S.
asset tag — An individual code assigned to a system, usually by an administrator, for
security or tracking purposes.
backup — A copy of a program or data file. As a precaution, back up your system’s
hard drive(s) on a regular basis.
blade — A module that contains a processor, memory, and a hard drive. The modules
are mounted into a chassis that includes power supplies and fans.
BMC — Baseboard management controller.
bootable media — A CD, diskette, or USB memory key that is used to start your
system if the system will not boot from the hard drive.
BTU — British thermal unit.
bus — An information pathway between the components of a system. Your system
contains an expansion bus that allows the processor to communicate with controllers
for the peripheral devices connected to the system. Your system also contains an
address bus and a data bus for communications between the processor and RAM.
C — Celsius.
cache — A fast storage area that keeps a copy of data or instructions for quick data
retrieval.
CA — Certificate authority.
CIM — Common Information Model describes the management information utilized
by the DMTF. It provides mapping techniques for interchange of CIM data with MIB
data from SNMP agents.
cm — Centimeter(s).

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Dell PowerEdge R310 Specifications

General IconGeneral
Tcase72.7 °C
Bus typeDMI
SteppingB1
FSB ParityNo
Processor codeSLBJH
Processor cache8 MB
Processor cores4
Processor modelX3470
System bus rate2.5 GT/s
Processor seriesIntel Xeon 3400 Series
Processor socketLGA 1156 (Socket H)
Processor threads8
Processor codenameLynnfield
Motherboard chipsetIntel® 3420
Processing Die size296 mm²
Processor frequency2.93 GHz
Processor cache typeSmart Cache
Processor lithography45 nm
Processor manufacturerIntel
Processor package size37.5 x 37.5 mm
Processor front side bus- MHz
Processor boost frequency3.6 GHz
Processor operating modes64-bit
ECC supported by processorYes
PCI Express configurations1x16, 2x8, 4x4
Supported instruction setsSSE4.2
Thermal Design Power (TDP)95 W
Number of processors installed1
CPU multiplier (bus/core ratio)22
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3-SDRAM
Number of Processing Die Transistors774 M
Memory channels supported by processorDual
Memory clock speeds supported by processor800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)21 GB/s
Maximum internal memory supported by processor32 GB
HDD size3.5 \
Optical drive typeDVD-RW
Total storage capacity500 GB
Maximum storage capacity8 TB
Number of HDDs installed-
Memory slots6x DIMM
Internal memory2 GB
Graphics cardG200eW
LAN controllerBroadcom BCM5716
Networking featuresGigabit Ethernet
PS/2 ports quantity0
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
PCI Express slots version2.0
Power supply350 W
Compatible operating systemsWindows Server Novell Linux Solaris10
Chassis typeRack (1U)
Processor ARK ID42932
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth610 mm
Width434 mm
Height42.4 mm

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