Dell PowerEdge R6615 - Thermal air restrictions

Table 27. Particulate contamination specifications (continued)
Particulate contamination Specifications
NOTE: Air entering the data center must have MERV11 or MERV13
filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles
NOTE: This condition applies to data center and non-data center
environments.
Corrosive dust
● Air must be free of corrosive dust
● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity
NOTE: This condition applies to data center and non-data center
environments.
Table 28. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
Thermal air restrictions
Table 29. Cooling components
Label Description
STD Standard performance
HPR Gold High performance
EXT. HSK. External Heat sink
LP Low profile
FH Full height
Table 30. Air cooling: Thermal restriction matrix (non-GPU)
Configuration No BP
8 x 2.5-
inch U.2
4 x 3.5-
inch
10 x 2.5-inch SAS
10 x 2.5-
inch NVMe
Rear storage
No Rear Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
2.5-inch
SAS x 2
No Rear
Drives
cTDP
Mod
el
Core Count
CPU
TDP/
cTDP
240
W
9334 32 35°C 35°C 35°C 35°C 35°C 35°C
240
W
9224 24 35°C 35°C 35°C 35°C 35°C 35°C
240
W
9254 24 35°C 35°C 35°C 35°C 35°C 35°C
240
W
9124 16 35°C 35°C 35°C 35°C 35°C 35°C
300
W
9634 84 35°C 35°C
Not
Supported
30°C 30°C 30°C
300
W
9534 48 35°C 35°C 30°C 30°C 30°C
32 Technical specifications