Dell PowerEdge R6625 - Thermal Restriction Matrix

Table 27. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
Thermal restriction matrix
Table 28. Processor and heat sink matrix
Heat sink Notes
T-type HSK Air-cool HSK
Table 29. Label reference
Label Description
STD Standard
HPR Gold High Performance Gold
HSK Heat sink
LP Low profile
FH Full height
Table 30. Thermal restriction matrix for air cooling configuration
Configuration 4 x 3.5-inch
SAS
10 x 2.5-inch SAS 8 x 2.5-inch
NVMe
No BP Ambient
Tempera
ture
Rear configuration 3 LP/ 2 FH 3 LP/ 2
FH
Rear 2 x
2.5-
inch
SAS
3 LP/ 2
FH
2LP 3 LP
CPU
TDP
CPU
cTDP
Max
Model Core
Count
Fan Type
210 W 240 W 9334 32 STD Fan HPR Gold
fan
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
35°C
200 W 240 W 9254 24 STD Fan HPR Gold
fan
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
35°C
200 W 240 W 9224 24 STD Fan HPR Gold
fan
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
35°C
200 W 240 W 9124 16 STD Fan HPR Gold
fan
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
35°C
290 W 300 W 9634 84 STD Fan* HPR Gold
fan*
HPR
Gold
fan*
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
35°C
290 W 300 W 9454 48 STD Fan* HPR Gold
fan*
HPR
Gold
fan*
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
35°C
280 W 300 W 9534 64 STD Fan* HPR Gold
fan*
HPR
Gold
fan*
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
35°C
34 Technical specifications