Dell PowerEdge R6625 - Page 35

Table 30. Thermal restriction matrix for air cooling configuration (continued)
Configuration 4 x 3.5-inch
SAS
10 x 2.5-inch SAS 8 x 2.5-inch
NVMe
No BP Ambient
Tempera
ture
Rear configuration 3 LP/ 2 FH 3 LP/ 2
FH
Rear 2 x
2.5-
inch
SAS
3 LP/ 2
FH
2LP 3 LP
CPU
TDP
CPU
cTDP
Max
Model Core
Count
Fan Type
280 W 300 W 9354 32 STD Fan* HPR Gold
fan*
HPR
Gold
fan*
HPR
Gold fan
HPR
Gold fan
HPR
Gold fan
35°C
320 W 400 W 9174F 16 N/A N/A N/A HPR
Gold
fan*
HPR
Gold
fan*
HPR
Gold
fan*
35°C
320 W 400 W 9274F 24 N/A N/A N/A HPR
Gold
fan*
HPR
Gold
fan*
HPR
Gold
fan*
35°C
320 W 400 W 9374F 32 N/A N/A N/A HPR
Gold
fan*
HPR
Gold
fan*
HPR
Gold
fan*
35°C
360 W 400 W 9474F 48 N/A N/A N/A HPR
Gold
fan*
HPR
Gold
fan*
HPR
Gold
fan*
35°C
360 W 400 W 9554 64 N/A N/A N/A N/A N/A N/A 35°C
360 W 400 W 9654 96 N/A N/A N/A HPR
Gold
fan*
HPR
Gold
fan*
HPR
Gold
fan*
35°C
NOTE:
● * Supported ambient temperature is 30°C.
● Three dual fan modules are required for single processor, and four dual fan modules are required for dual processor
system.
● All air-cooling configurations require CPU shroud.
● OCP Shroud is required to be installed with No Riser Configuration (RC0) when OCP card is present.
● For CPU power > 240 W, DIMM Blank is required to be installed in all empty DIMM slots. For single processor
configuration, it follows the same rule for DIMM blanks support.
● For single processor configuration with 3 sets of fan, Fan1 location requires fan blank to be installed if there is no fan.
● For air cooling with 2 x 2.5-inch rear drive configuration, it is required to install Rear Drive Shroud in the system.
Table 31. Thermal restriction matrix for memory configuration
Configurat
ion
4 x 3.5-inch SAS 10 x 2.5-inch SAS 8 x 2.5-inch NVMe No BP
Rear
configurati
on
3 LP/ 2 FH 3 LP/ 2 FH Rear 2 x 2.5-
inch SAS
3 LP/ 2 FH 2LP 3 LP
DIMM
Configurat
ion
STD Fan HPR Gold fan
16 GB
RDIMM
35°C 35°C 35°C 35°C 35°C 35°C
32 GB
RDIMM
35°C 35°C 35°C 35°C 35°C 35°C
Technical specifications 35