Dell PowerEdge R860 - Thermal Air Restrictions

Table 30. Thermal restriction matrix for air cooled configurations (continued)
Configuration
24 x
2.5-inch
NVMe
16 x
2.5-inch
SAS + 8
x 2.5-
inch
NVMe
24 x 2.5-inch SAS
16 x 2.5-
inch
NVMe
16 x 2.5-
inch SAS
8 x 2.5-
inch SAS
Rear storage
No Rear
Drives
No Rear
Drives
No Rear
Drives
2 x 2.5-
inch
SAS/
NVMe
No Rear
Drives
No Rear
Drives
No Rear
Drives
270 W 72
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
270 W 71
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
330 W 76
30°C
(86° F)
30°C
(86° F)
30°C
(86° F)
30°C
(86° F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
330 W 77
30°C
(86° F)
30°C
(86° F)
30°C
(86° F)
30°C
(86° F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
350 W 79
30°C
(86° F)
30°C
(86° F)
30°C
(86° F)
30°C
(86° F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
Memory Ambient temperature
256 GB RDIMM
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
128 GB RDIMM
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
64 GB RDIMM NA*
32 GB RDIMM NA*
16 GB RDIMM NA*
NOTE: DIMM blanks must be installed in empty DIMM slots.
NOTE: *Memory will have the same thermal restrictions of the processor used.
NOTE: DIMM blanks must be installed in empty DIMM slots.
NOTE: *Memory will have the same thermal restrictions of the processor used.
Thermal air restrictions
Table 31. Air cooling thermal restriction for 24 x 2.5-inch NVMe/16 x 2.5-inch + 8 x NVMe/16 x NVMe
Storage Configurations
ASHRAE A2/35°C (95°F) A3/40°C (104°F) A4/45°C (113°F)
Processor
CPUs ≥ 330 W are not supported.
Maximum 30°C for CPU ≥ 330 W
CPUs ≤ 195 W are supported. Only 165 W is supported
PSU Two PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA Not supported
36 Technical specifications