ABOUT THIS MANUAL
................................................................3
What you can do with this manual
...........................................3
Using Adobe Reader (Windows version)
...................................4
SAFETY PRECAUTIONS
...............................................................6
NOTE FOR SCHEMATIC DIAGRAM
..............................................7
NOTE FOR PARTS LIST
................................................................7
Instructions for handling semi-conductors and optical unit
...7
1. Ground for Human Body
......................................................7
2. Ground for Workbench
........................................................7
TECHNICAL SPECIFICATIONS
.....................................................9
DIMENSION
..............................................................................10
DISASSEMBLY
..........................................................................11
1. HOUSING FRONT
................................................................12
2. AMP ASSY
...........................................................................13
Procedure after Replacing the Microprocessor, etc.
..............14
FIRMWARE UPDATE PROCEDURE
............................................15
1. MAIN PCB Update Procedure
.............................................15
2. Updating via USB
...............................................................17
3. Service region settings update procedures
.......................19
4. Service Release Type settings update procedures
.............20
5. Firmware burning procedure
after Core Module replacement ow
.................................21
6. How to check the version , Release Type, Locale
...............22
TROUBLE SHOOTING
................................................................23
1. Power not turn on
..............................................................23
2. No sound is output speaker
...............................................23
3. No sound is AUX Function
.................................................24
4. Cannot connect to network For a wired LAN
....................25
5. Cannot connect to network For a wireless LAN
.................26
6. USB device is not recognized
.............................................26
BLOCK DIAGRAM
.....................................................................27
WIRING DIAGRAM
....................................................................28
PRINTED CIRCUIT BOARDS
......................................................29
SCHEMATIC DIAGRAMS (01/11)
...............................................30
SCH01-AIOS Lego
....................................................................30
SCH02-AUDIO PROCESS
..........................................................31
SCH03-CTIA_QMTP
.................................................................32
SCH04-MCU
.............................................................................33
SCH05-MISC
............................................................................34
SCH06-POWER
........................................................................35
SCH07-Tweeter AMP
...............................................................36
SCH08-USB and ETHERNET
.....................................................37
SCH09-Woofer AMP
................................................................38
SCH10-S.Woofer AMP and HP AMP
.........................................39
SCH11-Key Board and HP JACK
...............................................40
EXPLODED VIEW
......................................................................41
Sealing gasket view of an air leak prevention
.......................42
Sheet view of the anti-vibration
.............................................43
PACKING VIEW
.........................................................................44
SEMICONDUCTORS
..................................................................45
1. IC's
......................................................................................45
CONTENTS
2
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