Espressif Systems ESP32-WROOM-32UE - 5.6 Reflow Profile

PRE
LIMINARY
5. El
ectrical Characteristics
5.6 Reflow Profile
Tem
perature
(

)
Pe
ak Temp.
250
235
~ 250
Pr
eheating zone
Re
flow zone
Co
oling zone
217
150
~ 200
60
~ 120s
!2
17 60 ~ 90s
-1
~ -5/s
200
So
ldering time
>
30s
Ra
mp-up zone
1
~ 3/s
100
50
25
Ti
me (sec.)
0
50
100
150
200
250
0
Ramp-up zone — Temp.: <150 Time: 60 ~ 90s Ramp-up rate: 1 ~ 3/s
Preheating zone — Temp.: 150 ~ 200 Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8/s
Reflow zone — Temp.: >217 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250 (<245 recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180 Ramp-down rate: -1 ~ -5/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 2: Reflow Profile
Espressif Systems 13
ESP32-WROOM-32UE User Manual
V0.1