Hot Swap/Hot Expansion (ETERNUS AF250)
The table below shows whether hot swap or hot expansion for components of the
ETERNUS AF250 is possible.
Table 48 Hot Swap and Hot Expansion Availability for Components (ETERNUS AF250)
Component Hot swap Hot expansion Remarks
Controller enclosure (CE)
´
— Replace the controller enclosure (CE) when
the MP (*1) fails.
Controller module (CM)
¡ (*2)
— —
System memory
¡ (*2)
— —
Controller firmware
¡ (*2) (*3)
— —
Host interface (FC-CA)
¡ (*2) ¡ (*2)
—
Host interface (10G iSCSI-CA)
¡ (*2) ¡ (*2)
—
Power supply unit (PSU)
¡
— —
SSD
¡ ¡
—
Operation panel (PANEL)
´ (*4)
— —
Disk firmware
¡ (*3)
— —
Drive enclosure (DE)
¡ ¡
Replace the drive enclosure (DE) when the
MP (*1) fails.
Power supply unit (PSU)
¡
— —
SSD
¡ ¡
—
Operation panel (PANEL)
´ (*4)
— —
I/O module (IOM)
¡
— —
Disk firmware
¡ (*3)
— —
¡: Allowed / ´: Not allowed (cold swap is possible) /
—: Not applicable
*1: Mid Plane. This is a board that is located between the front (drive side) and rear (controller (CM) side) of
the ETERNUS AF.
*2: All of the host interfaces on the CM that will have maintenance or expansion performed go offline. When a
multipath configuration is used, switch to the host paths of the CM that will not have maintenance per-
formed to continue operation.
*3: Depending on the changes in the firmware, this function may require I/Os to be temporarily stopped.
*4: Operation can be continued during a failure. The status of the ETERNUS AF can be monitored via ETERNUS
Web GUI or ETERNUS CLI.
User Expansion
Customers can expand (add) the following components.
To add components that are not described in this section, contact your sales representative or maintenance en-
gineer.
•
Drives
•
Drive enclosures
•
Long Wave SFP+ Modules (16Gbit/s)
4. Maintenance/Expansion
User Expansion
161
FUJITSU Storage ETERNUS AF250 S2, ETERNUS AF250 All-Flash Arrays
Design Guide (Basic)
Copyright 2019 FUJITSU LIMITED
P3AG-1822-09ENZ0
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