Fujitsu ETERNUS DX S5 Series - 7 Maintenance;Expansion; Hot Swap;Hot Expansion; Eternus Dx60 S5; Table 112 Hot Swap and Hot Expansion Availability for Components (ETERNUS DX60 S5)

7. Maintenance/Expansion
Hot Swap/Hot Expansion
"Hot swap" refers to the replacement of components or updating of the firmware while the system is running.
"Hot expansion" refers to the addition of components while the system is running.
ETERNUS DX60 S5
The table below shows whether hot swap or hot expansion for components of the ETERNUS DX60 S5 is possible.
Table 112 Hot Swap and Hot Expansion Availability for Components (ETERNUS DX60 S5)
Component Hot swap Hot expansion Remarks
Controller enclosure (CE)
´
— Replace the controller enclosure (CE)
when the MP (*1) fails.
Controller module (CM)
¡ (*2)
— —
System memory
¡ (*2)
— —
BBU
¡ (*2)
— —
BUD
¡ (*2)
— —
Controller firmware
¡ (*2) (*3)
— —
SFP+
¡ (*2) ¡
—
iSCSI port —
¡
—
SAS port —
¡
—
Power supply unit (PSU)
¡
— —
Disk (HDD)
¡ ¡
—
SSD
¡ ¡
—
Operation panel (PANEL)
´ (*4)
— —
Disk firmware
¡ (*3)
— —
Drive enclosure (DE)
¡ ¡
Replace the drive enclosure (DE)
when the MP (*1) fails.
Power supply unit (PSU)
¡
— —
Disk (HDD)
¡ ¡
—
SSD
¡ ¡
—
Operation panel (PANEL)
´ (*4)
— —
I/O module (IOM)
¡
— —
Disk firmware
¡ (*3)
— —
¡: Allowed / ´: Not allowed (cold swap is possible) /
—: Not applicable
*1: Mid Plane. This is a board that is located between the front (drive side) and rear (controller (CM) or I/O module (IOM) side) of the
ETERNUS DX
.
*2: When a multipath configuration is used, switch to the host paths of the CM that will not have maintenance performed to continue
operation.
*3: An I/O suspension may be required depending on the firmware changes.
*4: Operation can be continued during a failure. The status of the ETERNUS DX can be monitored via ETERNUS Web GUI or ETERNUS CLI.
301 Design Guide