Removing and installing componen ts
during servicing
Preparing to remove components
If you are going t o remove or change system components, prepare for the removal as follows:
Please observe the safety information in chapter "Important notes", Page 12.
Remove the power plug from the mains o utlet !
► Sw itch the device off.
The device must not be in energy-saving mode !
► Close the LC D screen.
► Remove all the cables from the device.
► Turn the device over and place it on a stable, flat and clean surface. If necessary, lay an
anti-slip cloth on this surface to pre v ent the device from being scratched.
► Remove the battery (see "
Removing a battery" , Page 29).
Installing and removing memory expansion
MemorymoduleMainmemoryRemovingmemorySystemexpan sionSystemexpansion
If you are asked by the Hotline/Service Desk to remove and install the memory
expansion yourself, proceed as follows:
Please observe the safety information in chapter "Important notes", Page 12.
When installing/removing memory modules, the battery must be removed from
the notebook and the notebook must not be connected to the power supply,
see "
Prep aring to remove components", Page 52.
Only use memory exp ansion modules that have been approved for your
notebook (see "
Technical data", Page 68).
Never use force when installing or removing a memory extension.
Make sure that foreign objects do not fall into the memory extension compartment.
You must open the service compart
ment to remove or install a memory module. On some devices,
opening the compartment may exp
ose other components. Th ese components should be removed
and replaced only by authorise
d s pecialists. Therefore, be sure to observe the following:
Individual components can be
come very hot during operation. Therefore, we
recommend that you wait one h o
ur after switching off the notebook before removing
or installing memory module
s. Otherwise, there is a risk of suffering burns!
As some components are expose
d that are sensitive to s tatic electricity, please take
note of chapter "
Notes on ins
talling and removing boards and components", Page 51.
52 Fujitsu Technology S olutions