HP 248 G1 User Manual

Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver #1
Type-cross
#1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Slide the battery latch to the unlock position and disassemble battery
2. Loosen HDD cover set (screw * 1) and remove HDD cover.
3. Loosen DDR cover set (screw * 1) and remove DDR Cover.
4. Loosen ODD (screw * 1), take out the ODD and Remove the (rubber * 2) on BTCB.
5. Disconnect HDD FFC on M/B and pull up the HDD, then take it out.
6. Disassemble WLAN cable from WLAN module / Loosen WLAN module screw and take out the WLAN module.
7. Loosen (screw * 1) and take out the mSATA.
8. Disassemble DDR and disassemble fan CNTR
9. Loosen BTCB (screw * 18)
10. Poke the position(K/B FFC), then turn the computer over and disconnect K/B FFC, then remove the K/B.
11. Disassemble TPCB.
12. Rip the tape and rip the gasket then disassemble FP.
13. Loosen (screw * 1) and disassemble SD card/B.
14. Loosen (screw * 1) and rip the gasket, then disassemble power/B
15. Loosen (screw * 2) and disconnect TP FFC from TP module then disassemble pick button/B.
16. Rip the tapes and disconnect speaker cable then disassemble speaker
17. Loosen (screw* 1) and disconnect FFC from M/B then disassemble USB/B.
18. Rip the fan mylar and loosen (screw * 2) then disassemble fan.
19. Disconnect LVDS cable and rip gasket and tape.
20. Loosen M/B (screw * 4) and take out the M/B.
21. Loosen (screws left * 3) & (screws right * 4) and disassemble antenna from hooks, then separate LCM from BTCB.
22. Remove (mylar* 2)Loosen (screw* 2) then disassemble bezel.
23. Loosen (screw * 4) and disconnect LVDS cable.
24. Disassemble hinge bracket – L/R.
25. Loosen (screw * 4).
26. Disassemble antenna cables.
27. Take out the camera module from BTDL and disconnect cable from camera.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total part disassembly
3.22 Remove battery module
3.23 Remove service door
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01

HP 248 G1 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Black, Silver
Country of origin	China
Bus type	DMI2
Stepping	C0
Tjunction	100 °C
Processor cache	3 MB
Processor cores	2
Processor model	i5-4200U
System bus rate	- GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-4200 Mobile series
Processor socket	BGA 1168
Processor threads	4
Processor codename	Haswell
Processor frequency	1.6 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.6 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x4, 2x4
Thermal Design Power (TDP)	15 W
Maximum number of PCI Express lanes	12
Motherboard chipset	-
Memory slots	2x SO-DIMM
Internal memory	4 GB
Memory clock speed	1600 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR3L-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 4 GB
HDD speed	5400 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	500 GB
Compatible memory cards	SD
Number of HDDs installed	1
Display diagonal	14 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
On-board graphics card ID	0xA16
Discrete graphics card model	AMD Radeon HD 8670M
On-board graphics card model	Intel® HD Graphics 4400
Discrete graphics memory type	GDDR3
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card base frequency	200 MHz
On-board graphics card dynamic frequency (max)	1000 MHz
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
DisplayPorts quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Operating system installed	FreeDOS
Processor code	SR170
Processor ARK ID	75459
Intel TSX-NI version	0.00
Processor package size	40 x 24 x 1.5 mm
Intel ME Firmware Version	9.5
Supported instruction sets	AVX 2.0
Intel Smart Connect Technology version	1.00
Battery capacity	41 Wh
Battery life (max)	- h
AC adapter power	90 W

Weight and Dimensions

Depth	347 mm
Width	245 mm
Height	22.9 mm
Weight	2000 g