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HP 250 G1 - Page 96

HP 250 G1
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The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal materials are included with the fan/
heat sink assembly, processor, and system board spare part kits.
NOTE: The following illustration shows the replacement thermal material locations on a computer model
equipped with an AMD processor.
88 Chapter 4 Removal and replacement procedures ENWW

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