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HP 470 17 inch G9 Notebook PC - Page 51

HP 470 17 inch G9 Notebook PC
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3. Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the
heat sink and system board spare part kits. The following illustration shows the replacement thermal
material locations.
Thermal paste is used on the system board component (1) and on the heat sink area (2) that services it.
Remove the heat sink from models with discrete graphics:
1. In the order indicated on the heat sink, remove the six Phillips M2.0 × 2.8 screws (1) that secure the heat
sink to the computer.
Heat sink
45

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