EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the screws of stand，get down the stand
2. Dismantle the cover of monitor
3. Pull out the pin of KEPC board at the mian board ,get down the KEPC board and bezel
4. Dismantle the screws of PANEL
5. Pull out of the PIN of lamp
6. Pull out of the PIN of LVDS cable
7. Separate the mainframe and PANEL
8. Tear up the Mylar and dismantle the power board screws
9. Dismantle the VGA screws and HDID screws
10. Dismantle the main board screws、usb shielding screws、usb screws and DP screw
11. Pull out the pin of usb, and gain the main board and power board
12. Pull out the connector PIN which connect PWPC and main board;
13. Take off both boards
14.
15.
16.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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