HP EliteOne 800 G2 Hardware Reference Guide

A Electrostatic discharge
A discharge of static electricity from a finger or other conductor may damage system boards or other static-
sensitive devices. This type of damage may reduce the life expectancy of the device.
Preventing electrostatic damage
To prevent electrostatic damage, observe the following precautions:
●
Avoid hand contact by transporting and storing products in static-safe containers.
●
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
●
Place parts on a grounded surface before removing them from their containers.
●
Avoid touching pins, leads, or circuitry.
●
Always be properly grounded when touching a static-sensitive component or assembly.
Grounding methods
There are several methods for grounding. Use one or more of the following methods when handling or
installing electrostatic-sensitive parts:
●
Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist
straps are flexible straps with a minimum of 1 megohm +/- 10 percent resistance in the ground cords.
To provide proper ground, wear the strap snug against the skin.
●
Use heelstraps, toestraps, or bootstraps at standing workstations. Wear the straps on both feet when
standing on conductive floors or dissipating floor mats.
●
Use conductive field service tools.
●
Use a portable field service kit with a folding static-dissipating work mat.
If you do not have any of the suggested equipment for proper grounding, contact an HP authorized dealer,
reseller, or service provider.
NOTE: For more information on static electricity, contact an HP authorized dealer, reseller, or service
provider.
Preventing electrostatic damage 61

HP EliteOne 800 G2 Specifications

General

Screen shape	Flat
Display diagonal	23 \
Touch technology	Multi-touch
Native aspect ratio	16:9
Detachable display	No
Intel segment tagging	Enterprise
Storage drive interface	Serial ATA
Tcase	71 °C
Bus type	DMI3
Stepping	R0
Processor code	SR2BX
Processor cache	6 MB
Processor cores	4
Processor model	i5-6500
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-6500 Desktop series
Processor socket	LGA 1151 (Socket H4)
Processor codename	Skylake
Processor frequency	3.2 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.6 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	65 W
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	2133, 1333, 1600, 1866 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
SSD interface	SATA
Storage media	SSD
Optical drive type	DVD Super Multi
Total storage capacity	256 GB
Compatible memory cards	Not supported
Number of storage drives installed	1
Memory slots	2
Internal memory	8 GB
Memory slots type	SO-DIMM
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Memory layout (slots x size)	2 x 4 GB
On-board graphics card ID	1912
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 530
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Product color	Silver
Country of origin	China
Product type	All-in-One PC
Motherboard chipset	Intel® Q170
Wi-Fi standards	Wi-Fi 4 (802.11n)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
AC adapter power	160 W
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
Sustainability certificates	ENERGY STAR
Scalability	1S
Processor ARK ID	88184
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.2, AVX 2.0, SSE4.1
Thermal solution specification	PCG 2015C
Intel Stable Image Platform Program (SIPP) version	1.00

Weight and Dimensions

Depth (with stand)	58.9 mm
Width (with stand)	567.1 mm
Height (with stand)	392.7 mm
Weight (with stand)	7340 g