EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
items
included in
greater than 2.5 cm in diameter or height
External electrical cables and cords
DC Cable for External Power Supply
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove lower
2. Remove battery
3. Remove HDD
4. Remove bracket and DC-in cable
5. Remove thermal module
6. Remove IO/B
7. Remove wlan card, SSD bracket, SSD module
8. Remove MB
9. Remove Power/B, Sensor/B
10. Remove speaker, TP button
11. Remove hinge up
12. Remove Bezel
13. Remove hinge
14. Remove Panel
15. Remove Panel bracket
16. Remove antenna cable, camera module