HP Pavilion 27 Series

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 screwdriver(Phillips head)
T3
Description #2 screwdriver(Phillips head)
M3
Description #3 screwdriver(Phillips head)
T3
Description #4 screwdriver(Phillips head)
M2
Description #5 screwdriver(plum flower head)
M2
Description #6 screwdriver(Phillips head)
M3
Description #7 screwdriver(Phillips head)
M3
Description #8 screwdriver(Phillips head)
M3
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Quick release Base stand
2. Strip the screws from rear cover so that the rear metal cover can be removed , after be turn back
3. Strip the keypad line and led line and all tapes
4. To remove the shielding(contain the other material )
5. Strip the screws from PCBA
6. Release all materials
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Below action which may easily damage product .please notice it
Take out the
Tapes with
hand.
N/A
1
Take out the
speaker line
and take out
the speaker
with hand
N/A
2
Take out the
LED line
N/A
3