EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove battery
2. Remove BASE screw*14
3. Disassemble Base
4. Pull out antenna, LCD cable, speaker-R, and FFC*5 (HDD, Touchpad, Keyboard Membrane, Keyboard BLK, DB board
5. Dis-fasten CPU, GPU, Fan screw*9 and remove fan, thermal module
6. Pull out DC-in cable and speaker -L cable
7. Dis-fasten MB screw*1, speaker screw*4, DB board screw*2, and remove HDD, speaker L&R
8. Remove MB and DB board
9. Dis-fasten midle cap screw*2 and hinge screw*3
10. Disassemble Top assy and LCD assy
11. Dis assemble LCD bezel
12. Dis-fasten panel screw*4, hinge screw*6
13. Remove panel, hinge
14. Dis-fasten inner cap screw*4
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Remove battery
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