EL-MF877-00 Page 2
Template Revision A
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 screw driver
TORX T8
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove Battery module
2. Remove Mini card door
3. Remove Ram door.
4. Remove Blue tooth door.
5. Remove HDD door.
6. Remove HDD module
7. Remove ODD assembly
8. Remove Keyboard
9. Remove strip cover (with power button PCB & caps lock PCB)
10. Remove LCD cable and antenna connector
11. Divide LCD assembly from base assembly
12. Remove palm rest sub-assembly
13. Remove TP module & RTC battery
14. Divide logic-up assembly(w/buttons) from base assembly
15. Divide small PCB from base assembly
16. Remove speaker
17. Remove fan module
18. Divide MB from base assembly
19. Divide RS232 PCB & RJ11 from lower sub-assy
20. Divide thermal module & ODD trans PCB
21. Divide LCD cover & LCD bezel.
22. Divide LCD panel and Hinge Bracket.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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