HP ProLiant DL360 G7 - Power and Grounding Requirements

Removal and replacement procedures 28
PCIe riser board
To remove the component:
1. Power down the server (on page 13).
2. Extend the server from the rack (on page 14).
3. Remove the access panel ("Access panel" on page 16).
4. If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or
FBWC capacitor pack" on page 25).
5. Remove the air baffle ("Air baffle" on page 26).
6. Remove the PCI riser board assembly ("PCI riser board assembly" on page 26).
7. Remove all expansion boards ("Expansion boards" on page 27).
8. Remove the full-length PCIe riser board from the riser board assembly.
To replace the component, reverse the removal procedure.
PCI-X riser board
To remove the component:
1. Power down the server (on page 13).
2. Extend the server from the rack (on page 14).
3. Remove the access panel ("Access panel" on page 16).
4. If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or
FBWC capacitor pack" on page 25).
5. Remove the air baffle ("Air baffle" on page 26).
6. Remove the PCI riser board assembly ("PCI riser board assembly" on page 26).
7. Remove all expansion boards ("Expansion boards" on page 27).