HP W1858 - Page 2

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
ESD wrist ring Wrist which forfend static
1
ESD glove Glove which forfend static
1
Screwdriver type:3220/5200
、
shank type2#
：φ
=5mm
、
L=85mm
1
Screwdriver type:3220/5200
、
shank type hexagram
：φ
=5mm
、
L=85mm
1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the screws of stand，get down the stand
2. Dismantle BEZEL
3. Dismantle the button，pull out the pin of KEPC board ,get down the KEPC board
4. Pull out the PIN of power of key board ,and get down it
5. Rdismantle REAR COVER
6. Dismantle the D-SUB screws and HDMI screws
7. Pull out the pin of speaker , get down the right and left speaker .
8. Pull out the PIN of lamp
9. Dismantle the screws of PANEL
10. Pull out the PIN of FFC cabel， separate the mainframe and PANEL
11. Dismantle the screws of main board and PWPC board
12. First :tear off the black tape ;Second: pull out the connector PIN which connect PWPC and main board;Third: take off
both boards
13. Pull out the pin of KEPC cable and FFC cable
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).