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HP Xw8400 - Workstation - 4 GB RAM - Environmental Specifications; PCI Card Slot Power Specification

HP Xw8400 - Workstation - 4 GB RAM
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Environmental specifications
This section describes environmental specifications of your workstation.
Table 1-12 Environmental Specifications
Temperature (operating) 40° to 95° F (5° to 35° C)
Temperature (non-operating) –40° to 140° F (–40° to 60° C)
Humidity (operating) 8% to 85% RH, non-condensing
Humidity (non-operating) 8% to 90% RH, non-condensing
Altitude (operating) 0 to 10,000 ft. (3,048 m)
Altitude (non-operating) 0 to 30,000 ft. (9,144 m)
Shock (operating) 1/2-sine: 40 G, 2–3 ms
Shock (non-operating) 1/2-sine: 160 cm/s, 2–3 ms, (approximately 100 G)
square: 605 cm/s, 30 G
NOTE Values represent individual shock events and
are not indicative of repetitive shock events.
Vibration (operating) Operating random: 0.5 G (rms), 5–300 Hz
Vibration (non-operating) Random: 2.0 G (rms), 10–500 Hz
NOTE Values are not indicative of continuous
vibration.
PCI card slot power specification
Table 1-13 PCI and PCI Express slot power specifications
Slot# Slot Type Slot Power (Maximum)
1 PCI (32–bit, 33 MHz) 25 W*
2 PCI Express x16 graphics 150 W**
3 PCI Express x8 (x4) 25 W*
4 PCI Express x16 (x4) 25 W*
5 PCI-X 133 25 W*
6 PCI-X 100 25 W*
7 PCI-X 100 25 W*
* In addition to these slot power specifications, the overall power
consumption of the system (including I/O cards, processor, and
memory) must not exceed the maximum ratings of the system power
supply. See
Power supply specifications on page 7 for details.
** Includes 75 W maximum from the system board connector, and
75 W maximum from the auxiliary graphics power connector.
ENWW Product specifications 11

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