Huawei E173 - Disposal and Recycling Information; Reduction of Hazardous Substances Compliance

HUAWEI E173 HSPA USB Stick V100R001
Product Description
Issue 01 (2010-03-10) Commercial in Confidence Page 16 of 21
5 Technical Reference
5.1 Layer 1 S
z
nel Coding and Multiplexing TR 25.944
Channels onto Physical Channels
3
4
z
Physical Layer–Measurements (FDD) TS 25.215
z
3GPP HSDPA overall description 25.308
5.2 Layer 2 Specifications (MAC/RLC)
z
MAC Protocol Specification TS 25.321
5.3 Layer 3 S
z
UE Interlayer Procedures in Connected Mode TS 25.303
z
UE Procedures in Idle Mode TS 25.304
5.4 Layer 3 N
ode TS 23.122
z
Mobile Radio Interface Signaling Layer 3–General Aspects TS 24.007
pecifications (Physical)
Examples of Chan
z
Physical Layer–General Description TS 25.201
z
Physical Channels and Mapping of Transport
(FDD) TS 25.211
z
Multiplexing and Channel Coding (FDD) TS 25.212
z
Spreading and Modulation (FDD) TS 25.21
z
Physical Layer–Procedures (FDD) TS 25.21
z
3GPP UE radio access capabilities 25.306
z
RLC Protocol Specification TS 25.322
pecifications (RRC)
z
RRC Protocol Specification TS 25.331
AS/Core Network (MM/CM)
z
Architectural Requirements for Release 1999 TS 23.121
z
NAS Functions Related to Mobile Station (MS) in Idle M