Huawei FusionServer Pro XH321 V5 - Page 173

Drive
Backplane
Processor
Model
Heat Sink Drive and
Memory
Conguratio
n
Max. Air
Inlet
Temperature
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor (P ≤
165 W)
Narrow
conjoined
heat sinks
● Drives ≤ 24
● DIMMs ≤
16
35°C (95°F)
Wide
conjoined
heat sinks
b
● 8 < drives
≤ 16
● DIMMs ≤
12
30°C (86°F)
● 0 < drives
≤ 8
● DIMMs ≤
12
35°C (95°F)
X6000 V5 C10
12 x 3.5" SAS
backplane
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor
(165 W < P ≤
205 W)
Wide
conjoined
heat sinks
● 4 < drives
≤ 8
● DIMMs ≤
12
30°C (86°F)
● 0 < drives
≤ 4
● DIMMs ≤
12
35°C (95°F)
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor (P ≤
165 W)
Narrow
conjoined
heat sinks
● Drives ≤ 12
● DIMMs ≤
16
35°C (95°F)
Wide
conjoined
heat sinks
b
● 4 < drives
≤ 8
● DIMMs ≤
12
30°C (86°F)
● 0 < drives
≤ 4
● DIMMs ≤
12
35°C (95°F)
● a: The C00 model does not support Intel
®
Xeon
®
Scalable (Gold 6144, Gold
6146, Gold 6244, and Gold 6252N) processors.
● b: When Intel
®
Xeon
®
Scalable (Gold 6144, Gold 6146, Gold 6244, or Gold
6252N) processors are
congured, wide conjoined heat sinks are required to
meet the high heat dissipation requirement.
FusionServer Pro XH321 V5 Server Node
Maintenance and Service Guide A Appendix
Issue 17 (2021-03-09) Copyright © Huawei Technologies Co., Ltd. 164