Huawei RH8100 V3 - Page 54

Table 2-18 Compute module component description
No. Item Function
1 Compute
module
Houses the memory board and CPU. The CPU is installed on
the CPU board of the compute module.
The compute modules are numbered 1 to 8 from left to right.
In dual-system mode, compute modules 1 to 4 belong to
system A and compute modules 5 to 8 belong to system B.
When only four compute modules are
congured, install
them in slots 1 to 4. See Figure 2-17.
2/3 Memory Each compute module supports a maximum of two memory
board. The memory board specications are as follows:
● 8 DIMM memory board: supports a maximum of 8 DIMMs.
● 12 DIMM memory board: supports a maximum of 12
DIMMs.
The memory model varies depending on the CPU model:
● When congured with Intel
®
Xeon
®
E7-8800 v2 CPUs, the
server supports only DDR3 DIMMs. Each DDR3 DIMM
provides a maximum of 64 GB memory capacity. The
server provides a maximum of 12 TB memory capacity,
and supports 1333 or 1600 MHz DIMMs.
● When
congured with Intel
®
Xeon
®
E7-8800 v3 or E7-8800
v4 CPUs, the server supports only DDR4 DIMMs. Each
DDR4 DIMM provides a maximum of 64 GB memory
capacity. The server provides a maximum of 12 TB memory
capacity, and supports 1333, 1600, or 1866 MHz DIMMs.
4 Heat sink Adopts foolproof design and cools a CPU. Each CPU is
congured with one heat sink.
5 CPU Provides three QPI channels for connecting to other CPUs.
Each RH8100 V3 compute module supports one Intel
®
Xeon
®
E7-8800 v2, E7-8800 v3, or E7-8800 v4 CPU.
NOTE
● When E7 v2/v3 CPUs are
congured, use HFCs whose BOM
number is 03022JBN.
● When E7 v4 CPUs are
congured, use HFCs whose BOM number is
03023URP.
RH8100 V3 Server
User Guide 2 About the RH8100 V3
Issue 30 (2019-12-19) Copyright © Huawei Technologies Co., Ltd. 44