IMSAL 8080 System
General Assembly Notes
Discrete Components
Resistors and diodes can be installed most neatly using a
lead bender to bend the leads consistantly. Most pads for
this sort of component are .5” apart.
Disc ceramic capacitors often have the dipped insulation
extending down the leads a short distance, preventing these
from being pulled down all the way to the board. This in
sulation may be broken off by squeezing it in the pliers.
Take it off until the bare wire comes up to the level of
the bottom of the capacitor.
All discrete components should be held in their desired
final position while being soldered. Normally this means
holding them against the board by putting a slight bend
in the lead behind the board so the component cannot lift
from the board. (See the sketch for a way of bending the
leads we find works better than simply finger-bending them
slightly.) Components not held in place look sloppy and
it is much harder to move them once they are soldered. In
some cases, a little extra lead is needed, such as to lay
the disc capacitors down on top of the chips on the front
panel board. In these cases the solution is again to hold
them in their final position during the soldering operation.
This insures that the leads are left the proper length.
Pull sideways A ”
Grip with pliers
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