Lenovo IDEAPAD Z560 User Manual

Note:
Before using this information and the product it supports, be sure to read the general information under
“Notices” on page 92
First Edition (Apr. 2010)
© Copyright Lenovo 2010. All rights reserved.
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Lenovo IDEAPAD Z560 Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
Processor model	i3-350M
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-300 Mobile Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.26 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	17
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	-
HDD speed	7200 RPM
HDD interface	SATA
Optical drive type	DVD-RW
Card reader integrated	Yes
Total storage capacity	320 GB
Compatible memory cards	Memory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed	1
Display diagonal	15.6 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Internal memory	2 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	- GB
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	667 MHz
Power supply type	AC/DC
Power requirements	100-240V
Wireless technology	Wi-Fi
Compliance industry standards	IEEE 802.11 b/g/n
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
Operating system installed	Windows 7 Home Premium
Charging port type	DC-in jack
Serial ports quantity	0
USB 2.0 ports quantity	3
Cable lock slot type	Kensington
Product color	Black
Pointing device	Touchpad
Processor code	SLBPL
Processor ARK ID	43529
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2
Physical Address Extension (PAE)	36 bit

Weight and Dimensions

Weight	2200 g