Lenovo ThinkSystem SD530 V3 - Page 23

Table 3. Configurations with one processor, under 35°C (continued)
Processor configuration
Conditionally supported
components
Commonly supported
components
– One OCP module
• Keep the ambient temperature to 30°C or lower with the following system configuration:
Table 4. Configurations with one processor, under 30°C
Processor configuration Conditionally supported
components
Commonly supported
components
– One processor with up to 350-
watt TDP
– Performance heat sink
– One PCIe adapter with 2 ports
– One OCP module
– Up to eight 96 GB RDIMMs
– Up to two E3.S 1T drives
– Up to two M.2 drives
– One PCIe Ethernet adapter
– One OCP module with 2 ports
– One GPU adapter
– One OCP module
– One processor with up to 300-
watt TDP
– Performance heat sink
– One PCIe adapter with 2 ports
– One OCP module
– Up to eight 128 GB 3DS
RDIMMs
– Up to two E3.S 1T drives
– Up to two M.2 drives
– One PCIe Ethernet adapter
– One OCP module with 2 ports
Table 5. Configurations with two processors, under 30°C
Processor configuration
Conditionally supported
components
Commonly supported
components
– Two processors with up to 150-
watt TDP
– Processor 1 with standard heat
sink
– Processor 2 with performance
heat sink
– One GPU adapter
– One OCP module
– Up to sixteen 64 GB RDIMMs
– Up to two E3.S 1T drives
– Up to two M.2 drives
– One PCIe adapter with 2 ports
– One OCP module
– One PCIe Ethernet adapter
– One OCP module with 2 ports
• Keep the ambient temperature to 25°C or lower with the following system configuration:
Table 6. Configurations with one processor, under 25°C
Processor configuration Conditionally supported
components
Commonly supported
components
– One processor with up to 350-
watt TDP
– Performance heat sink
– One PCIe adapter with 2 ports
– One OCP module
– Up to eight 128 GB 3DS
RDIMMs
– Up to two E3.S 1T drives
– Up to two M.2 drives
– One PCIe Ethernet adapter
Chapter 1. Introduction 13