• To ensure the best performance, check the manufacturing date on the new heat sink and make sure it
does not exceed 2 years. Otherwise, wipe off the existing thermal grease and apply the new grease onto it
for optimal thermal performance.
Notes:
• PHMs are keyed for the socket where they can be installed and for their orientation in the socket.
• See
https://static.lenovo.com/us/en/serverproven/index.shtml for a list of processors supported for your
server. All processors on the system board must have the same speed, number of cores, and frequency.
• Before you install a new PHM or replacement processor, update your system firmware to the latest level.
See “Update the firmware” in the ThinkSystem SR650 V2 Setup Guide.
• The heat sink, processor, and processor carrier for the system might be different from those shown in the
illustrations.
The following illustration shows the components of the PHM.
Figure 225. PHM components
1 Heat sink
9 Clips to secure processor in carrier
2 Heat sink triangular mark
10 Carrier triangular mark
3 Processor identification label
11 Processor ejector handle
4 Nut and wire bail retainer 12 Processor heat spreader
5 Torx T30 nut 13 Thermal grease
6 Anti-tilt wire bail 14 Processor contacts
7 Processor carrier 15 Processor triangular mark
8 Clips to secure carrier to heat sink
302 ThinkSystem SR650 V2Maintenance Manual
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