EasyManua.ls Logo

Lenovo ThinkSystem SR665 - Handling Static-Sensitive Devices; Technical Rules

Lenovo ThinkSystem SR665
268 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Loading...
Handling static-sensitive devices
Use this information to handle static-sensitive devices.
Attention: Prevent exposure to static electricity, which might lead to system halt and loss of data, by
keeping static-sensitive components in their static-protective packages until installation, and handling these
devices with an electrostatic-discharge wrist strap or other grounding system.
Limit your movement to prevent building up static electricity around you.
Take additional care when handling devices during cold weather, for heating would reduce indoor
humidity and increase static electricity.
Always use an electrostatic-discharge wrist strap or other grounding system, particularly when working
inside the server with the power on.
While the device is still in its static-protective package, touch it to an unpainted metal surface on the
outside of the server for at least two seconds. This drains static electricity from the package and from your
body.
Remove the device from the package and install it directly into the server without putting it down. If it is
necessary to put the device down, put it back into the static-protective package. Never place the device
on the server or on any metal surface.
When handling a device, carefully hold it by the edges or the frame.
Do not touch solder joints, pins, or exposed circuitry.
Keep the device from others’ reach to prevent possible damages.
Technical rules
This topic provides technical rules for the server.
“Drive bay configurations and requirements” on page 143
“Technical rules for GPU” on page 151
“” on page
“Technical rules for memory modules” on page 139
“Technical rules for processor and heat sink” on page 139
“Technical rules for system fans” on page 152
Technical rules for heat sink
The following lists the required heat sinks and fans when different processors are installed.
Processor TDP
With Mid bays/Full-length GPUs Without Mid bays/Full-length GPUs
Heat sink
1U STD 2U Perf. 2U STD 2U Perf.
Group C
120W
Group B
155W
Group A
180/200W
Group D
225/240W
Group Z
280W
136 ThinkSystem SR665 Setup Guide

Table of Contents

Other manuals for Lenovo ThinkSystem SR665

Related product manuals