4.5.1 GSM Quad-Band PAM (U100: SKY77544)
The module consists of a GSM850/900 PA and DCS1800/PCS1900 PA block, impedance-matching circuitry for 50 Ω input and
output impedances, Tx harmonic filtering, high linearity-low insertion loss switches, and a CMOS Power Amplifier Control (PAC)
block. A custom silicon integrated circuit contains decoder circuitry to control the RF switch while providing a low current
external control interface. An integrated temperature sensor provides an analog voltage based on the temperature of the
module.
Applications
• Quad-band cellular handsets encompassing -Class 4 GSM850/900 -Class 1 DCS1800 PCS1900 -Class 12 GPRS
multi-slot operation -EDGE polar modulation -Triple band WCDMA antenna
switch support
Features
Small outline: 6 mm x 6 mm
Very low profile: 0.9 mm
28-pad package
Low input power range -0 to 6 dBm
High efficiency -GSM850 41% -GSM900 41% -DCS 38% -PCS 38%
Tx-VCO-to-antenna and antenna-to-Rx-SAW filter RF interface
Tx harmonics below -38 dBm
Wideband envelope control path
Input/Output matching 50 Ω internal
Low APC current 20 ÎĽA
High impedance control inputs 15 ÎĽA, typical
Integrated module temperature sensor
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