13. EXPLODED VIEW & REPLACEMENT PART LIST
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Copyright © 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Level LocationNo. Description PartNumber Spec Remark
6 C1118
Inductor
Multilayer,Chip
EAP62227601
LG HK 0603 6N8J-T 6.8NH 5% - 250mA - -
0.39OHM 3.9GHZ 5 SHIELD - 0.6X0.3X0.3MM
R/TP TAIYO YUDEN CO.,LTD
6 U4010
IC,LDO Voltage
Regulator
EAN62669801
TLV70728PDQNR V2 to V5.5 V2.8 0W QFN R/TP
4P - TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.
6 C2001
Capacitor
Ceramic,Chip
ECCH0009107
GRM033R71C222K 2.2nF 10% 16V X7R -
55TO+125C 0603 R/TP - - KOREA MURATA
ELECTRONICS CO. LTD.
6 C1114 Resistor,Chip EBC62115901
RC0603J680CS 68OHM 5% 1/20W 0603 R/TP -
SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R2013 Resistor,Chip ERHZ0000405
MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP
- ROHM.
6 L1038
Inductor
Multilayer,Chip
ELCH0003820
LQG15HS3N0S02D 3NH 0.3NH - 300mA 0.17OHM
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO.,LTD.
6 C2026
Capacitor
Ceramic,Chip
ECCH0000137
C1005X7R1H331KT000F 0.33nF 10% 50V X7R -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6 R1012 Resistor,Chip ERHY0009302
MCR006YZPF1001 1KOHM 1% 1/20W 0603 R/TP -
ROHM.
IC,Digital
MSM8225 576NSP,Dual ARM Cortex A5/L2
1GHz HSPA7 2Mbps FWVGA30fps 8M MIPI
6 U2001 Baseband
Processor,3G
EAN62505801
,
.
,
,
,
CSI_DSI NSP R/TP 576P QUALCOMM
INCORPORATED.
6 R3013 Resistor,Chip EBC61856101
RC0201JR-0722RL 22OHM 5% 1/20W 0603 R/TP -
YAGEO CORPORATION
6 C1025
Inductor
Multilayer,Chip
EAP62228101
LG HK 0603 39NJ-T 39NH 5% - 100mA - -
1.72OHM 1.5GHZ 4 SHIELD - 0.6X0.3X0.3MM
R/TP TAIYO YUDEN CO.,LTD
6 L1035
Inductor
Multilayer,Chip
ELCH0003847
LQG15HS1N8S02D 1.8NH 0.3NH - 300mA - -
0.1OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP MURATA MANUFACTURING CO.,LTD.
6 R2010 Resistor,Chip ERHY0042405
RC0201FR-074K02L 4.02KOHM 1% 1/20W 0603
R/TP - YAGEO CORPORATION