LG LG-X230DS - Network and Tethering Features

LGE Internal Use Only
U101_MT6737_BB chip IC , Digital Baseband Processor(Top)
U602_KMFNX0012M-B214,IC,MCP. eMMC+LPDDR3(Top)
U401_MT6328_IC,PMIC (Top)
6. BGA PIN MAP
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rved. Only training and service purposes
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