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CHAPTER 6 INSTALLATION AND WIRING
6
6.1 Installation
CHAPTER 6 INSTALLATION AND WIRING
This chapter describes the installation and wiring of a master/local module.
6.1 Installation
This section describes the installation of a master/local module.
(1) Setting method
For details on the implementation of the master/local module, refer to the following.
QCPU User's Manual (Hardware Design, Maintenance and Inspection)
(2) Handling precautions
The following is a list of precautions for handling the master/local module:
• Do not drop or apply strong shock to the module case since it is made from resin.
• Do not remove the printed-circuit board of the module from the case. Doing so may cause failure.
• Prevent foreign matter such as dust or wire chips from entering the module. Such foreign matter can cause a
fire, failure, or malfunction.
• A protective film is attached to the top of the module to prevent foreign matter, such as wire chips, from
entering the module during wiring. Do not remove the film during wiring. Remove it for heat dissipation
before system operation.
• Before handling the module, touch a grounded metal object to discharge the static electricity from the human
body. Failure to do so may cause the module to fail or malfunction.
• Tighten the screws such as module fixing screws within the following range.
*1 The module can be easily fixed onto the base unit using the hook at the top of the module. However, fixing with a module
fixing screw is recommended under the locations that vibrations often occur.
Screw Tightening torque range
Module fixing screw (M3 screw)
*1
0.36 to 0.48N•m
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