A-4 Computer Group Literature Center Web Site
Specifications
A
While the exact amount of airflow required for cooling depends on the
ambient air temperature and the type, number, and location of boards and
other heat sources, adequate cooling can usually be achieved with 10 CFM
and 490 LFM flowing over the module. Less airflow is required to cool the
module in environments having lower maximum ambients. Under more
favorable thermal conditions, it may be possible to operate the module
reliably at higher than 55° C with increased airflow.
It is important to note that there are several factors, in addition to the rated
CFM of the air mover, which determine the actual volume and speed of air
flowing over a module.
EMC Regulatory Compliance
The MVME240x was tested in an EMC-compliant chassis and meets the
requirements for EN55022 CE Class B equipment. Compliance was
achieved under the following conditions:
❏ Shielded cables on all external I/O ports.
❏ Cable shields connected to chassis ground via metal shell
connectors bonded to a conductive module front panel.
❏ Conductive chassis rails connected to chassis ground. This provides
the path for connecting shields to chassis ground.
❏ Front panel screws properly tightened.
❏ All peripherals were EMC-compliant.
For minimum RF emissions, it is essential that the conditions above be
implemented. Failure to do so could compromise the EMC compliance of
the equipment containing the module.
The MVME240x is a board level product and meant to be used in standard
VME applications. As such, it is the responsibility of the OEM to meet the
regulatory guidelines as determined by its application.
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