Isometric view of the heatsink-less DPU Controller:
Component Side Print Side (with Stiffener)
General Notes
1. The Thermal Transfer Plate (TTP) may encompass an internal liquid cooling system
within a cold plate.
2. The M3 screws maximum protrusion length according to stiffener thread depth is
listed in Mechanical Interfaces.
3. Recommended torque values: M3: 0.35~0.4 Nm. Use a locking mechanism.
4. To ensure unobstructed access for replacement, ensure that the battery is not
blocked. Refer to Encapsulation and Battery on SFG.
5. When considering encapsulation, ensure there is no interference with the TTP. The
encapsulation is presented as the maximum tolerance on the SFG and is labeled
with ENC. Refer to Encapsulation and Battery on SFG.
Components that Require Cooling
It is the responsibility of the customer to ensure proper cooling and thermal regulation
for all components on the board. The provided guidelines are minimal and are based on
NVIDIA's air-cooling thermal solution. Note the following:
The DPU controller SoC require contact with TTP on the component side of the
product.
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