NXP Semiconductors MPC5777M - Page 135

Ordering information
MPC5777M Microcontroller Data Sheet, Rev. 6
NXP Semiconductors 135
Figure 61. Product code structure
MC Qualification Status
Power Architecture Core
Automotive Platform
Processor Core
Flash Memory Size
Product/Family Name
PC 57 5Example code: Mxx
Qualification Status
MPC = Full specification qualified
SPC = Mask specification qualified
PPC = Engineering samples
Automotive Platform
55 = PPC in 130 nm
56 = PPC in 90 nm
57 = PPC in 55 nm
Processor Core
0 = e200z0
1 = e200z1
2 = e200z2
3 = e200z3
4 = e200z4
5 = e200z6 without VLE
6 = e200z6
7 = e200z7
Miscellaneous
D = Dual Core
T = Triple Core
Q = Quad Core
S = Single Core
2 = Emulation Device
Fab and Mask Revision
F = ATMC
K = TSMC
0 = Revision
Flash Memory Size
Temperature Specification
C = –40 °C to 85 °C
V = –40 °C to 105 °C
M = –40 °C to 125 °C
K = –40 °C to 135 °C
z0, z2 z4 z7
1 256 KB 1 MB 1 MB
2 384 KB 1.5 MB 1.5 MB
3 512 KB 2 MB 2 MB
4 768 KB 2.5 MB 3 MB
5 1 MB 3 MB 4 MB
6 1.5 MB 4 MB 6 MB
7 2 MB 5 MB 8 MB
8 2.5MB 6MB 12MB
9 3MB 8MB 16MB
Package Code
ZP = 416 PBGA SnPb
VA = 416 PBGA Pb-free
VA = 512 TEPBGA Pb-free
VU = 416 TEPBGA Pb-free
VF = 208 MAPBGA SnPb
VM = 208 MAPBGA Pb-free
ZQ = 324 PBGA SnPb
VZ = 324 PBGA Pb-free
LQ = 144 LQFP Pb-free
LU = 176 LQFP Pb-free
KU = 176 LQFP ep Pb-free
MP = 292 MAPBGA Pb-free
OU = 216 FQ (176 leads)
Maximum Frequency
0 = 64 MHz
1 = 80 MHz
2 = 120 MHz
3 = 150 MHz
4 = 160 MHz
5 = 200 MHz
8 = 300 MHz
Suffix
A = cut2.0 revision
T = Tape
R = Reel
M
Miscellaneous (Optional)
Fab and Mask Revision
Temperature
Package Code
Maximum Frequency
Tape or Reel
46MQ RF0