18.2 Procedure
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1. Tack the flat pack IC to the PCB by temporarily soldering two diagonally opposite pins in the
correct positions on the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering iron along the tips of the pins
while feeding enough solder to the tip so that it flows under the pins as they are heated.
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