Fig. 7
4.1.10. HOW TO ACCESS THE MANUAL TRACKING CONTROL
4.1.11. REPLACEMENT PROCEDURE FOR LEADLESS (CHIP) COMPONENT
The following procedures are recommended for the replacement of the leadless components
used in this Unit.
1. Preparation for replacement
A. Soldering Iron
Use a pencil-type soldering iron using less than 30 watts.
B. Solder
Eutectic Solder (Tin 63 %, Lead 37 %) is recommended.
C. Soldering time
26
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