Samsung MultiXpress M537x series - Page 3

Contents
2.6.2.Fuserunitdrive...........................................................................................................2−39
2.6.3.Fuserunittemperaturecontrol........................................................................................2−40
2.7.LaserScanningUnit(LSU)........................................................................................................2−41
2.7.1.LSUoverview.............................................................................................................2−41
2.7.2.LaserScanningOpticalpath..........................................................................................2−43
2.7.3.Lasersynchronizingdetectors........................................................................................2−44
2.8.DriveSystem..........................................................................................................................2−46
2.8.1.DriveMotors..............................................................................................................2−46
2.8.2.MainDriveUnit..........................................................................................................2−47
2.8.2.1.MainDrive(OPC_Regi._Pick-up_MP_Duplex)..................................................2−48
2.8.2.2.MainDrive(Deve_Agitaitor_TonerSupply).......................................................2−49
2.8.3.Fuser_ExitDrive.........................................................................................................2−50
2.9.ScannerSystem.......................................................................................................................2−51
2.9.1.ScannerSystemoverview.............................................................................................2−51
2.9.2.ScanningSystemComponents.......................................................................................2−52
2.10.DualScanDocumentFeeder(DSDF)...........................................................................................2−53
2.10.1.DSDF(DualScanDocumentFeeder)overview..................................................................2−53
2.10.2.Electricalpartslocation................................................................................................2−54
2.10.3.DSDFDriveSystem....................................................................................................2−56
2.11.HardwareConguration............................................................................................................2−58
2.11.1.Mainboard.................................................................................................................2−61
2.11.2.MSOK......................................................................................................................2−63
2.11.3.FaxJointPBA............................................................................................................2−63
2.11.4.FaxCard(Optional).....................................................................................................2−64
2.11.5.FDI(Optional)............................................................................................................2−64
2.11.6.OPEHubPBA............................................................................................................2−65
2.11.7.SMPSboard...............................................................................................................2−66
2.11.8.FuserDriveBoard(FDB)..............................................................................................2−68
2.11.9.HVPSboard...............................................................................................................2−69
2.11.10.FinisherPBA..............................................................................................................2−71
2.11.11.SCF_HCFboard..........................................................................................................2−72
2.11.12.CRUMJointPBA........................................................................................................2−72
2.11.13.Sub-CassettePBA.......................................................................................................2−73
2.11.14.CRUMPBA..............................................................................................................2−73
2.11.15.EraserPBA................................................................................................................2−74
2.11.16.FuserCRUMPBA.......................................................................................................2−74
3.DisassemblyandReassembly................................................................................................................3−1
3.1.Precautionswhenreplacingparts..................................................................................................3−1
3.1.1.Precautionswhenassemblinganddisassembling.................................................................3−1
3.1.2.PrecautionswhenhandlingPBA.......................................................................................3−1
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