Samsung ProXpress M387 Series - Hardware Configuration

2.ProductSpecications
2.2.5.Hardwareconguration
ProXpressM337x/M387x/M407xseriesElectricalCircuitsystemconsistsofthefollowing:
•Maincontroller
•OPEcontroller
•DDR3SODIMM
•SCFboard(Option)
•SMPSboard
•HVPSboard
•WLANModule(M387xFWonly)
•MICROSD4GB(M407xFR/M407xFXonly)
DiagramoftheM337xFD/387xFD/387xFW/407xFR/407xFX/4072FDSeriesElectricalCircuit
DDR3 DIMM
(128MB)
MAIN
A15 0 0
FUS ER Unit
The rm oSta t
The rm isto r1
Exit
Se nsor
Re gi
Clutch
Pickup
Clutch
Fr ont Cove r
Micro S witch
24V
5V_SMPS
FUS ER ON
24VS
3.3 V
3 .3V_C over _ Open 1
3.3 V_C over _Ope n3.3 V
DEVELOP ER Unit
FAN MAIN
FAN
SMPS
OP C MHV
DEV
Supply
THV
Va ristor
T
D
S
DRUM
M
EEP R OM
(32KB)
0
0
Network
RTL8211E
25 MHz
FUS ER
BIAS
INLET
Pa per
Outb infull
Se nsor
12 MHz
MAIN CLK
US B 2.0
1 2
CN24(2mm )
THERM
nM OT_D IR MAIN_BLDC_CLK MO T_R EADY nM OT_E N GN D GN D GN D GN D 24 VS 24 VS 24 VS P ICKUP _C LT 24 VS RE GI_C LT
1 2 3 4 5 6 7 8 9
10 11 12 13 14
CN31( 2mm)
MAIN MOTOR
3. 3V_P S G ND nS EN S_P_ EXIT
1 2 3
CN7(2mm )
EXIT
S ENS OR
3. 3V_P S G ND
n S ENS_ BIN_F ULL
3. 3V_C_O PE N1 3. 3V_C_O PE N2
1 2 3 4 5
CN2( 1.5mm )
OUTBIN FULL
COVE R OP E N
VB US
DM
DP
GND
1
2
3
4
CN 21
USB_IF
MX0P
MX0N
MX1P
MX2P
MX2N
MX1N
MX3P
MX3N
GND
LE D1
LE D0
3.3V _P S
GND
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CN 20
NE TWORK_IF
N. C N. C
LED_ ECO
N. C
nK EY_EC O
PWR _LE D
nPO W ER_ SW
GN D
5V _SUS
nK EY_C ANCE L
LED_ RE ADY
LED_ ER RO R LE D_TO NE R
CN9
(1.5 mm )
OP E I/ F(LED)
1 2 3 4 5 6 7 8 9
10 11 12 13
HVPS
13 12 11 10
9 8 7 6 5 4 3 2 1
24 VS
GND
THV_ RE AD
nTH V_E N
P WM_THV
P WM_DE V_DC
P WM_MHV
P WM_FU S ER _BIAS
GND
GND
3. 3V
3. 3V_C ov er_ Op en 1
1
2
3
4
5
6
7
8
9
10
11
12
CN8(1. 5mm)
HVP S
5V_S MP S
GND
24V1
GND
1
2
3
4
CN22
(3 .9 6m m)
S MPS
SMPS
5V _S MP S
GND
24 V1
GND
1
2
3
4
CN
SMP S
GND
24 V OFF
Re lay
24 VS
Fus e r ON
1
2
3
4
5
CN
S MPS
GND
24V OFF
Re lay_ AC_O N
24VS
Fus e r ON
5
4
3
2
1
CN26
(2mm)
SM PS
24 VS
GND (FB )
N. C
FAN _MAIN
1
2
3
CN30
(2 mm )
MAIN FA N
24VS
F AN_S MPS (F/B)
1
2
CN29
(2 mm )
S MPS FA N
12
11
10
9
8
7
6
5
4
3
2
1
EMPTY
Se nsor
REGI
Se nsor
3. 3VS G ND
n S ENS_ P _EMP TY
3. 3VS G ND
n S ENS_ P _RE GI
3. 3VS G ND
n S ENS_ P _FEE D
1 2 3 4 5 6 7 8 9
CN6(2mm)
SENSOR
24 VS MP_ CLU TCH 3. 3VS G ND S ENS _MP
1 2 3 4 5
CN 19(2mm )
MP
FEED
Se nsor
24 VS
GN D
THV_R EA D
nTH V_ EN
P WM_THV
P WM_DE V_DC
P WM_MHV
P WM_FU S ER_B IAS
GN D
GN D
3.3V
3.3V _C ov er_Op en
W
LAN
NAND FLASH
(128MB)
MP
Clutch
MP
Se nsor
AMBIENT GN D
1 2
CN28(2 mm)
AIR
TEMP
USB HUB
Co ver
Ope n
Am bie nt
Tem p
Se nsor
32.7KHz
RTC CLK
25 MHz
LE D4(Re s er ved) nK EY_4 (Res e rve d) LE D_EC O LE D_3 _1 _BLUE(R es e rv ed ) nK EY_EC O LE D_PO WE R nK EY_PO W ER GN D 5V nK EY_C ANCE L LE D_R EADY LE D_ER RO R LE D_TO NER
3.3V DM DP GN D GN D N.C
1 2 3 4 5 6
CN16
USB_IF
CL CL CL
3.3 V_Co ver _Op en 2
5V _S U S P
N.C
GND
5V _S U S P
1
2
3
4
CN35
P ARALLEL
PARALLE L
OP TION
DDR3 DIMM
(256MB)
r
r
ML-4 2 1 0/15 ND
OP PANEL
(LED)
nPO WE R_ SW
5V _SUS P
G ND
OP E _TXD OPE _ RXD
nR S T_OP E
CN 18
(1.5 mm )
OP E I/F(2lLINE)
1 2 3 4 5 6
OP E_ LC D
LC D (2-Line )
6 5 4 3 2 1
nPO WE R_ SW 5V GN D OPE _ RXD OPE _ TXD nR ST_O P E
INLET
L N
FUSE R
L
N
10
9 8 7 6 5 4 3 2 1
Ma in Mot or
CW /CCW
CLO CK REA DY
ST ART/STO P
NC
BR AKE
GN D GN D +24 V +24 V
Co ver
Ope n
Se nsor
3.3V _PS GN D nSENS_Co_Open
1 2 3
CN27 (1.5 mm)
Cover Open
S ENS OR
3 2 1
3 2 1
3 2 1 3 2 1
3 2 1 3 2 1 3 2 1
GND
S CL1
3.3V _C RU M
S DA
1
2
3
4
CN9
(1 .5 mm)
Z-C RUM
CR UM
GND
S CL1
S DA1
3. 3V_C RU M
1
2
3
4
CN4
(2 mm )
CR UM
Z- CRU M
N.C
N.C
GND
S CL
3. 3V_C RU M
S DA
6
5
4
3
2
1
CRUM I/F PBA
T HERM_1
V_P ROTEC T_ON
3. 3V_LS U
nH sync
GN D
VDO_1 _P
VD O_1 _N
GN D
nS H _1 nS H _2
GN D
VDO_2 _P
VD O_2 _N
GN D
nLD _ON
LD_ POWE R
N.C
CLK _LSU _MO T
nR EADY_LS U
nLS U _MOT_E N
GN D
24 VS
20 19 18 17 16 15 14 13 12 11 10
9 8 7 6 5 4 3 2 1
CN17(F FC 1mm )
LS U_IF
20 19 18 17 16 15 14 13 12 11 10
9 8 7
CLK _LSU _MO T
nR E AD Y_LSU
nLS U _MOT _EN
GN D
24 VS
LSU
(Dual Beam )
5 4 3 2 1
3.3V _LSU
nHs ync
G ND
VD O_1 _P VDO _1 _N
G ND
nS H_1 nS H_2
G ND
VD O_2 _P VDO _2 _N
G ND
nLD_ON
LD_ P OWER
CN11(1.5 mm )
S CF_ IF
24 V1
24 V1
5V _S US P
nR S T_S C F
S CF _TXD
S CF _RX D
nS C F_O P R
_R E Q
GND
GND
GND
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
N.C
OP T_ nCMDR E Q
N.C
N.C
GN D
GN D
GN D
GN D
GN D
24 V
24 V
24 V
5V
5V
5V
OP T_ nRE S E T
OP T_ RXD
OP T_ TXD
SCF
DRAWER C N
Themaincontrollercontrolsallmodulesrequiredtoprint,thatis,LSU,HVPS,SMPS,FAN,Fuser,etc.
ThemaincontrollerreceivesprintdatafromthehostthroughnetworkorUSBPortorfax,Scanner.Ittakesthisinformation
andgeneratesprintablevideobitmapdata.EngineandVideocontrollerarenotseparated.
ThemaincontrolleradoptstheA1500(600MHz)CPU,DIMMPBAonDDR3memoryandexternalmemorytoperform
printingandScanjobssuccessfully.
TheOPEcontrollerdisplaysthestatusofthesystemusing16x4lineLCDinresponsetouseractionsorthemaincontroller.
TheHVPSsupplieshighvoltagefordevelopingProcess.HighV oltagecontrolledbyPWMsignalfromCPU.
SMPSmakes+5Vand+24VDCfrom220Vor110AC.
WLANmoduleisusedforwirelesscommunication.
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